1. Foreword

   • Seung H. Kang
   • N. M. Ravindra

   Special Issue Paper Pages: 981 - 981

2. Study of electron-scattering mechanism in nanoscale Cu interconnects

   • Choong-Un Kim
   • Jaeyong Park
   • Rod Augur

   Special Issue Paper Pages: 982 - 987

3. Electromigration failure in ultra-fine copper interconnects

   • Nancy L. Michael
   • Choong-Un Kim
   • Rod Augur

   Special Issue Paper Pages: 988 - 993

4. TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnects

   • H. Wang
   • A. Gupta
   • J. Narayan

   Special Issue Paper Pages: 994 - 999

5. Thermomechanical response and stress analysis of copper interconnects

   • E. S. Ege
   • Y. -L. Shen

   Special Issue Paper Pages: 1000 - 1011

6. Effect of stresses on the evolution of annealing textures in Cu and Al interconnects

   • Dong Nyung Lee
   • Hyo Jong Lee

   Special Issue Paper Pages: 1012 - 1022

7. In-situ nanoindentation of epitaxial TiN/MgO (001) in a transmission electron microscope

   • A. M. Minor
   • E. A. Stach
   • I. Petrov

   Special Issue Paper Pages: 1023 - 1027

8. Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films

   • A. K. Sikder
   • Ashok Kumar
   • M. Sanganaria

   Special Issue Paper Pages: 1028 - 1033

9. Silicon nitride processing for control of optical and electronic properties of silicon solar cells

   • Bhushan Sopori

   Special Issue Paper Pages: 1034 - 1042

10. Light emission from silicon: Some perspectives and applications

    • A. T. Fiory
    • N. M. Ravindra

    Special Issue Paper Pages: 1043 - 1051

11. Modeling and simulation of emissivity of silicon-related materials and structures

    • N. M. Ravindra
    • Krshna Ravindra
    • Anthony T. Fiory

    Special Issue Paper Pages: 1052 - 1058

12. Deformation and interfacial sliding in back-end interconnect structures in microelectronic devices

    • C. Park
    • I. Dutta
    • J. Vella

    Special Issue Paper Pages: 1059 - 1071

13. Formation of nickel disilicide using nickel implantation and rapid thermal annealing

    • Chel-Jong Choi
    • Sung-Young Chang
    • K. N. Tu

    Special Issue Paper Pages: 1072 - 1078

14. Properties of Bi-doped PbTe layers grown by liquid phase epitaxy under controlled Te vapor pressure

    • Wataru Tamura
    • Arata Yasuda
    • Jun-Ichi Nishizawa

    Special Issue Paper Pages: 1079 - 1084

15. Crystallization behavior and ferroelectric properties of PbTiO₃/Ba_0.85Sr_0.15TiO₃/PbTiO₃ sandwich thin film on Pt/Ti/SiO₂/Si substrates

    • Shaobo Liu
    • Yanqiu Li
    • Meidong Liu

    Special Issue Paper Pages: 1085 - 1089

16. Condensed phase equilibria in transition metal-Ga-Sb systems and predictions for thermally stable contacts to GaSb

    • W. E. Liu
    • S. E. Mohney

    Special Issue Paper Pages: 1090 - 1099

17. The impact of deep levels on the photocurrent transients in semi-insulating GaAs

    • M. Pavlović
    • B. Šantić
    • U. V. Desnica

    Special Issue Paper Pages: 1100 - 1106

18. Self-limiting growth of ZrO₂ films on a Si(100) substrate using ZrCl₄ and O₂ under atmospheric pressure

    • Naoyuki Takahashi
    • Naoki Yoshii
    • Masayuki Yoshioka

    Special Issue Paper Pages: 1107 - 1110

19. The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—The effect of Ga

    • Kang-I Chen
    • Kwang-Lung Lin

    Special Issue Paper Pages: 1111 - 1116

20. Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film

    • M. A. Uddin
    • M. O. Alam
    • H. P. Chan

    Special Issue Paper Pages: 1117 - 1124

21. Recent progress of (Ba,Sr)TiO₃ thin films for tunable microwave devices

    • Xinhua Zhu
    • Jianmin Zhu
    • Chung-Loong Choy

    Special Issue Paper Pages: 1125 - 1134

22. Influence of H₂- and N₂-ambient annealing of indium-tin oxide film on plastic substrate for organic light-emitting diode

    • C. J. Huang
    • W. C. Shih

    Letter Pages: L9 - L13