Volume 42, Issue 2

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February 2013

Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Issue Editor:

Darrel Frear

17 articles in this issue

Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints
P. Darbandi
T.R. Bieler
Tae-kyu Lee
OriginalPaper 11 December 2012 Pages: 201 - 214
The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance
Tae-Kyu Lee
Bite Zhou
Jeng-Gong Duh
OriginalPaper 11 December 2012 Pages: 215 - 223
Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM)
J.J. Williams
N.C. Chapman
N. Chawla
OriginalPaper 08 August 2012 Pages: 224 - 229
Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies
Ye Tian
Justin Chow
Suresh K. Sitaraman
OriginalPaper 08 November 2012 Pages: 230 - 239
An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints
Govindarajan Muralidharan
Kanth Kurumaddali
Scott G. Leslie
OriginalPaper 11 December 2012 Pages: 240 - 248
Effect of Alloying Elements on the Electrification–Fusion Phenomenon in Sn-Based Eutectic Alloys
Gong-An Lan
Truan-Sheng Lui
Li-Hui Chen
OriginalPaper 19 October 2012 Pages: 249 - 255
Influence of Composition on the Morphology of Primary Cu₆Sn₅ in Sn-4Cu Alloys
Stuart McDonald
Kazuhiro Nogita
Tetsuro Nishimura
OriginalPaper 05 September 2012 Pages: 256 - 262
Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects
Zhiyong Wu
Zhiheng Huang
Changqing Liu
OriginalPaper 01 August 2012 Pages: 263 - 271
Micro- and Nanostructure of Zn Whiskers and Their Coating
A. Etienne
E. Cadel
P. Pareige
OriginalPaper 02 August 2012 Pages: 272 - 279
Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches
Ran Zhao
Limin Ma
Fu Guo
OriginalPaper 13 November 2012 Pages: 280 - 287
Physicochemical Properties of Sn-Zn and SAC + Bi Alloys
Tomasz Gancarz
Janusz Pstruś
Hani Henein
OriginalPaper Open access 11 December 2012 Pages: 288 - 293
Characterization of Stress–Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling
G. Khatibi
M. Lederer
H. Ipser
OriginalPaper 18 October 2012 Pages: 294 - 303
Creep and Mechanical Properties of Cu₆Sn₅ and (Cu,Ni)₆Sn₅ at Elevated Temperatures
Dekui Mu
Han Huang
Kazuhiro Nogita
OriginalPaper 11 September 2012 Pages: 304 - 311
Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers
Nitin Jadhav
Maureen Williams
Eric Chason
OriginalPaper 02 October 2012 Pages: 312 - 318
Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD
Bite Zhou
Thomas R. Bieler
Wenjun Liu
OriginalPaper 10 November 2012 Pages: 319 - 331
Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics
Won Sik Hong
Chul Min Oh
Do Seop Kim
OriginalPaper 10 November 2012 Pages: 332 - 347
Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates
Koushik Ramachandran
Fuhan Liu
Rao Tummala
OriginalPaper 18 October 2012 Pages: 348 - 354

Volume 42, Issue 2

Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints

The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM)

Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies

An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints

Effect of Alloying Elements on the Electrification–Fusion Phenomenon in Sn-Based Eutectic Alloys

Influence of Composition on the Morphology of Primary Cu₆Sn₅ in Sn-4Cu Alloys

Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects

Micro- and Nanostructure of Zn Whiskers and Their Coating

Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches

Physicochemical Properties of Sn-Zn and SAC + Bi Alloys

Characterization of Stress–Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling

Creep and Mechanical Properties of Cu₆Sn₅ and (Cu,Ni)₆Sn₅ at Elevated Temperatures

Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers

Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD

Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics

Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates

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