Volume 42, Issue 2, February 2013

Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

ISSN: 0361-5235 (Print) 1543-186X (Online)

In this issue (17 articles)

  1. No Access

    OriginalPaper

    Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints

    P. Darbandi, T.R. Bieler, F. Pourboghrat, Tae-kyu Lee Pages 201-214
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  2. No Access

    OriginalPaper

    The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

    Tae-Kyu Lee, Bite Zhou, Thomas R. Bieler, Chien-Fu Tseng… Pages 215-223
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  3. No Access

    OriginalPaper

    Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM)

    J.J. Williams, N.C. Chapman, N. Chawla Pages 224-229
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  4. No Access

    OriginalPaper

    Study of Intermetallic Growth and Kinetics in Fine-Pitch Lead-Free Solder Bumps for Next-Generation Flip-Chip Assemblies

    Ye Tian, Justin Chow, Xi Liu, Yi Ping Wu… Pages 230-239
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  5. No Access

    OriginalPaper

    An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints

    Govindarajan Muralidharan, Kanth Kurumaddali… Pages 240-248
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  6. No Access

    OriginalPaper

    Effect of Alloying Elements on the Electrification–Fusion Phenomenon in Sn-Based Eutectic Alloys

    Gong-An Lan, Truan-Sheng Lui, Li-Hui Chen Pages 249-255
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    OriginalPaper

    Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys

    Stuart McDonald, Kazuhiro Nogita, Jonathan Read… Pages 256-262
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  8. No Access

    OriginalPaper

    Linkages Between Microstructure and Mechanical Properties of Ultrafine Interconnects

    Zhiyong Wu, Zhiheng Huang, Hua Xiong, Paul P. Conway… Pages 263-271
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  9. OriginalPaper

    Micro- and Nanostructure of Zn Whiskers and Their Coating

    A. Etienne, E. Cadel, A. Lina, L. Cretinon, P. Pareige Pages 272-279
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  10. No Access

    OriginalPaper

    Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches

    Ran Zhao, Limin Ma, Yong Zuo, Sihan Liu, Fu Guo Pages 280-287
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  11. OriginalPaper

    Physicochemical Properties of Sn-Zn and SAC + Bi Alloys

    Tomasz Gancarz, Janusz Pstruś, Władysław Gąsior… Pages 288-293
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  12. No Access

    OriginalPaper

    Characterization of Stress–Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling

    G. Khatibi, M. Lederer, E. Byrne, A. Betzwar Kotas… Pages 294-303
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  13. No Access

    OriginalPaper

    Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures

    Dekui Mu, Han Huang, Stuart D. McDonald, Kazuhiro Nogita Pages 304-311
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  14. No Access

    OriginalPaper

    Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers

    Nitin Jadhav, Maureen Williams, Fei Pei, Gery Stafford… Pages 312-318
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  15. No Access

    OriginalPaper

    Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD

    Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee, Wenjun Liu Pages 319-331
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  16. No Access

    OriginalPaper

    Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics

    Won Sik Hong, Chul Min Oh, Do Seop Kim Pages 332-347
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  17. No Access

    OriginalPaper

    Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates

    Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj… Pages 348-354
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