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Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates

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Abstract

Failures due to conductive anodic filament (CAF) formation in copper-plated through-vias have been a concern in printed wiring boards since the 1970s. With the continuous reduction in through-via pitch to meet high circuit density demands in organic packages, the magnitude of CAF failures is expected to be significantly higher. In this study, an accelerated test condition [130°C, 85% relative humidity (RH), and 100 V direct current (DC)] was used to investigate CAF in two organic package substrates: (1) cyclo-olefin polymer–glass fiber composite (XR3) and (2) epoxy–glass fiber composite (FR4). Test coupons with through-via spacing of 100 μm and 200 μm were investigated in this study. CAF failures were not observed in either substrate type with spacing of 200 μm. With spacing of 100 μm, insulation failures were observed in FR4, while XR3 exhibited stable insulation resistance during the test. The substrates were characterized using gravimetric measurement, and XR3 was found to exhibit significantly lower moisture absorption compared with FR4. The CAF failures in FR4 were characterized using scanning electron microscopy and energy-dispersive x-ray spectroscopy. The results suggest a strong effect of moisture sorption of organic resins on CAF failure at smaller through-via spacing in package substrates.

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References

  1. International Technology Roadmap for Semiconductors, ITRS 2010 Edition.

  2. J.N. Lathi, R.H. Delaney, and J.N. Hines, 17th Annual Proceedings of Reliability Physics (1979), p. 39.

  3. D.J. Lando, J.P. Mitchell, and T.L. Welsher, 17th Annual Proceeding of Reliability Physics (1979), p. 51.

  4. V. Sundaram, R.R. Tummala, F. Liu, P.A. Kohl, J. Li, S.A. Bidstrup-Allen, and Y. Fukuoka, IEEE Trans. Adv. Packag. 27, 315 (2004).

    Article  CAS  Google Scholar 

  5. A. Caputo, L.J. Turbini, and D.D. Perovic, Microsyst. Technol. Spec. Issue MicroNanoReliability. 15, 39 (2009).

    Google Scholar 

  6. B.S. Rudra, M.G. Pecht, and D. Jennings, IEEE Trans. Compon. Packag. Manuf. Technol. Part B. 17, 269 (1994).

    Google Scholar 

  7. J.A. Augis, D.G. DeNure, M.J. LuValle, J.P. Mitchell, M.R. Pinnel, and T.L. Welsher, 3rd International SAMPE Electronics Conference (1989), p. 1023.

  8. P.C. Liu, D.W. Wang, E.D. Livingston, and W.T. Chen, Adv. Electron. Packag. 4, 435 (1993).

    Google Scholar 

  9. B. De’Nève, and M.E.R. Shanahan, Polymer, 34, 5099 (1993).

  10. P.C. Liu, D.W. Wang, S.J. Fuerniss, M.D. Poliks, J. Orbzut, L.M. Siperko, W.T. Chen, R.D. Havens, and R.M. Murcko, Mater. Res. Soc. Symp. Proc. 323, 309 (1994).

    Article  CAS  Google Scholar 

  11. K.M. Takahashi, J. Electrochem. Soc. 138, 1587 (1991).

    Article  CAS  Google Scholar 

  12. B. Sood, and M. Pecht, J. Mater. Sci. Mater. Electron. 22, 1602 (2011).

    Google Scholar 

  13. T.L. Welsher, J.P. Mitchell, and D.J. Lando, 18th Annual Proceedings of Reliability Physics (1980), p. 235.

  14. J.P. Mitchell, and T.L. Welsher, Proceedings of Printed Circuit World Convention II (1981), p. 80.

  15. M.S. Gandhi, J. McHardy, R.E. Robbins, and K.S. Hill, Circuit World. 18, 23 (1992).

    Article  Google Scholar 

  16. W.J. Ready and L.J. Turbini, IEEE Trans. Compon. Packag. Manuf. Technol. Part B Adv. Packag. 23, 285 (2000).

    CAS  Google Scholar 

  17. W.J. Ready, L.J. Turbini, R. Nickel, and J. Fisher, J. Electron. Mater. 28, 1158 (1999).

    Article  CAS  Google Scholar 

  18. W.J. Ready and L.J. Turbini, J. Electron. Mater. 31, 1208 (2002).

    Article  CAS  Google Scholar 

  19. W.J. Ready, Reliability Investigation of Printed Wiring Boards Processed with Water Soluble Flux Constituents (Ph.D. Thesis in Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, 2000).

  20. S.Y.Y. Leung, D.C.C. Lam, and C.P. Wong, Proceedings of the 51st Electronic Components and Technology Conference (2001), p. 1333.

  21. E.P. Plueddemann, Silane Coupling Agents (New York: Plenum, 1991).

    Google Scholar 

  22. C. Cohn, and H. Kimbara, Electronics Packaging Technology Conference (2007), p. 86.

  23. L.J. Turbini, J. Mater. Sci. Mater. Electron. 18, 147 (2007).

    Article  CAS  Google Scholar 

  24. JEDEC JESD22-A110, Test method A110-B, Highly-Accelerated Temperature and Humidity Stress Test (HAST), Electronic industry alliance, Arlington, VA, 1999.

  25. IPC-TM-650 2.6.25, Conductive Anodic Filament (CAF) Resistance Test: X-Y axis, The institute for interconnecting and packaging, electronic circuits, IPC, Northbrook, IL, 2003.

  26. M. Yamazaki, J. Mol. Catal. A Chem. 213, 81 (2004).

    Article  CAS  Google Scholar 

  27. Y. He, and X. Fan, Proceedings of 57th Electronic Components and Technology Conference (2007), p. 1375.

  28. H. Su, X. Zhong, G. Zhan, Y. Yu, and W. Gan, J. Appl. Polym. Sci. 122, 2317 (2011).

    Article  CAS  Google Scholar 

  29. W.J. Ready, S.R. Stock, G.B. Freeman, L.L. Dollar, and L.J. Turbini, Circuit World. 21, 5 (1995).

    Google Scholar 

  30. A. Caputo, L.J. Turbini, and D.D. Perovic, J. Electron. Mater. 39, 85 (2010).

    Article  CAS  Google Scholar 

  31. A. DerMarderosian, Proceedings of IPC (Fall Meeting) (San Francisco, 1976), p. 708.

  32. A. Caputo, L.J. Turbini, and D.D. Perovic, J. Electron. Mater. 39, 92 (2010).

    Article  CAS  Google Scholar 

  33. W.J. Ready (Master of Science Thesis in Metallurgy, Georgia Institute of Technology, 1997).

  34. A. Caputo, L.J. Turbini, and D.D. Perovic, J. Electron. Mater. 40, 1884 (2011).

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. 3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, Atlanta, GA, 30332-0250, USA

    Koushik Ramachandran, Fuhan Liu, P. Markondeya Raj, Venky Sundaram & Rao Tummala

  2. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta, GA, 30332-0245, USA

    Koushik Ramachandran

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  1. Koushik Ramachandran
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  2. Fuhan Liu
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  3. P. Markondeya Raj
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  4. Venky Sundaram
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  5. Rao Tummala
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Correspondence to Koushik Ramachandran.

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Ramachandran, K., Liu, F., Raj, P.M. et al. Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates. J. Electron. Mater. 42, 348–354 (2013). https://doi.org/10.1007/s11664-012-2274-4

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  • DOI: https://doi.org/10.1007/s11664-012-2274-4

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