Journal of Electronic Materials

, Volume 42, Issue 2, pp 272–279 | Cite as

Micro- and Nanostructure of Zn Whiskers and Their Coating

  • A. Etienne
  • E. Cadel
  • A. Lina
  • L. Cretinon
  • P. Pareige
Article

Abstract

To understand the mechanisms at the origin of whisker formation and growth, a Zn-electroplated steel prone to whiskering was studied. Several samples were prepared from different locations of the electroplated plate. Care was taken to extract samples at the root, in the nodule, or away from whiskers. Samples were characterized using electron backscattered diffraction (EBSD). Crystallographic data from EBSD show that recrystallized regions are present at the root of whiskers and in their nodules. These observations support whisker growth models based on recrystallization. In addition, atom probe tomography samples were prepared in the center of whiskers. The distribution of Zn atoms is almost homogeneous and no impurities are present in the whiskers.

Keywords

Electroplating whiskers electron scattering diffraction recrystallization focused ion beam atom probe tomography 

References

  1. 1.
    H.L. Cobb, Mon. Rev. Am. Electroplat. Soc. 33, 28 (1946).Google Scholar
  2. 2.
    G.T. Galyon, IEEE Trans. Electron. Packag. Manuf. 28, 94 (2005).CrossRefGoogle Scholar
  3. 3.
    G.T. Galyon and L. Palmer, IEEE Trans. Electron. Packag. Manuf. 28, 17 (2005).CrossRefGoogle Scholar
  4. 4.
    E. Chason, N. Jadhav, W.L. Chan, L. Reinbold, and K.S. Kumar, Appl. Phys. Lett. 92, 171901 (2008).CrossRefGoogle Scholar
  5. 5.
    S. Lal and T.D. Moyer, IEEE Trans. Electron. Packag. Manuf. 28, 63 (2005).CrossRefGoogle Scholar
  6. 6.
    H.G. Smith and R.E. Rundle, J. Appl. Phys. 29, 679 (1958).CrossRefGoogle Scholar
  7. 7.
    M.W. Barsoum, E.N. Hoffman, R.D. Doherty, S. Gupta, and A. Zavaliangos, Phys. Rev. Lett. 20, 206104 (2004).CrossRefGoogle Scholar
  8. 8.
    J. Brusse and M. Sampson, IT Prof. IEEE Comput. Soc. 6, 43 (2004).Google Scholar
  9. 9.
    U. Lindborg, S. Ramsin, L. Lind, and L. Révay, Plating 61, 1111 (1974).Google Scholar
  10. 10.
    A. Baated, K.-S. Kim, and K. Suganuma, J. Mater. Res. 25, 2175 (2010).CrossRefGoogle Scholar
  11. 11.
    H.L. Reynolds and R. Hilty, IPC/JEDEC Lead Free North America Conference (Boston, 2004).Google Scholar
  12. 12.
    A. Etienne, E. Cadel, A. Lina, L. Cretinon, and P. Pareige, IEEE Trans. Compon. Packag. Manuf. Technol., in press (2012). doi:10.1109/TCPMT.2012.2203134
  13. 13.
    G.D. Costa, F. Vurpillot, A. Bostel, M. Bouet, and B. Deconihout, Rev. Sci. Instrum. 76, 013304-1 (2005).Google Scholar
  14. 14.
    D. Blavette, A. Bostel, J.M. Sarrau, B. Deconihout, and A. Menand, Nature 363, 432 (1993).CrossRefGoogle Scholar
  15. 15.
    E. Bémont, A. Bostel, M. Bouet, G. Da Costa, S. Chambreland, B. Deconihout, and K. Hono, Ultramicroscopy 95, 231 (2003).CrossRefGoogle Scholar
  16. 16.
    I. Boguslavsky and P. Bush, APEX Conf. (Anaheim, CA, 2003).Google Scholar
  17. 17.
    J. Smetana, IEEE Trans. Electron. Packag. Manuf. 30, 11 (2007).CrossRefGoogle Scholar
  18. 18.
    U. Lindborg, Acta Metall. 24, 181 (1976).CrossRefGoogle Scholar
  19. 19.
    P.T. Vianco and J.A. Rejent, J. Electron. Mater. 38, 1815 (2009).CrossRefGoogle Scholar

Copyright information

© TMS 2012

Authors and Affiliations

  • A. Etienne
    • 1
  • E. Cadel
    • 1
  • A. Lina
    • 2
  • L. Cretinon
    • 3
    • 4
  • P. Pareige
    • 1
  1. 1.Groupe de Physique des MatériauxUniversité et INSA de Rouen, UMR CNRS 6634Saint Etienne du Rouvray CedexFrance
  2. 2.Department Material and Mechanic Components, Corrosion Studies LaboratoryEDF R&DMoret sur Loing CedexFrance
  3. 3.Department Electrical Equipment LaboratoryEDF R&DMoret sur Loing CedexFrance
  4. 4.EDF SEPTENVilleurbanne CedexFrance

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