Abstract
The process of a cluster-containing water jet impinging on a monocrystalline silicon substrate was studied by molecular dynamics simulation. The results show that as the standoff distance increases, the jet will gradually diverge. As a result, the solidified water film between the cluster and the substrate becomes “thicker” and “looser”. The “thicker” and “looser” water film will then consume more input energy to achieve complete solidification, resulting in the stress region and the high-pressure region of the silicon substrate under small standoff distances to be significantly larger than those under large standoff distances. Therefore, the degree of damage sustained by the substrate will first experience a small change and then decrease quickly as the standoff distance increases. In summary, the occurrence and maintenance of complete solidification of the confined water film between the cluster and the substrate plays a decisive role in the level of damage formation on the silicon substrate. These findings are helpful for exploring the mechanism of an abrasive water jet.
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References
Hashish M. Visualization of the abrasive-waterjet cutting process. Exp Mech 28(2): 159–169 (1988)
Guha A, Barron R M, Balachandar R. An experimental and numerical study of water jet cleaning process. J Mater Process Technol 211(4): 610–618 (2010)
Fähnle O W, Brug H V, Frankena H J. Fluid jet polishing of optical surface. Appl Opt 37: 6771–6773 (1998)
Horiuchi O, Ikeno J, Shibutani H, Suzuki H, Mizukami Y. Nano-abrasion machining of brittle materials and its application to corrective figuring. Precision Engineering 31: 47–54 (2007)
Loc P H. Investigation of optimal air-driving fluid jet polishing parameters for the surface finish of N-BK7 optical glass. J Manuf Sci Eng 135(1): 228–229 (2013)
Srinivasu D S, Axinte D A, Shipway P H, Folkes J. Influence of kinematic operating parameters on kerf geometry in abrasive waterjet machining of silicon carbide ceramics. Int J Mach Tool Manu 49(14): 1077–1088 (2009)
Hashish M, Plessis M P D. Prediction equations relating high velocity jet cutting performance to stand off distance and multipasses. J Manuf Sci Eng 101(3): 311–318 (1979)
Anglani F, Barry J, Dekkers W, Khare S. CFD modelling of a water-jet cleaning process for concentrated solar thermal (CST) systems. In Proceedings of third Southern African Solar Energy Conference, University of Pretoria, South Africa, 2015: 389–394
He Z G, Li G S, Wang H Z. Shen Z G, Tian S C, Lu P Q, Guo B. Numerical simulation of the abrasive supercritical carbon dioxide jet: The flow field and the influencing factors. J Hydrodyn 28(2): 238–246 (2016)
Kordonski W, Shorey A B. New magnetically assisted finishing method: material removal with magnetorheological fluid jet. Proc SPIE 5180: 107–114 (2004)
Karakurt I, Aydin G, Aydiner K. An Experimental Study on the Depth of Cut of Granite in Abrasive Waterjet Cutting. Mater Manuf Process 27(5): 538–544 (2012)
Zhang X C, Dai Y F, Li S Y, Peng X Q. Effect on material removal of magnetorheological jet polishing by several parameters. Opt Precision Eng 14(6): 1004–1008 (2006)
Liu H, Wang J, Kelson N, Brown R J. A study of abrasive waterjet characteristics by CFD simulation. J Mater Process Technol 153(1): 488–493 (2004)
Momber A W, Kovacevic R. Principles of Abrasive Water Jet Machining. London (UK): Springer London, 1998
Cleveland C L, Landman U. Dynamics of cluster-surface collisions. Science 257(5068): 355–361 (1992)
Henkel M, Urbassek H M. Ta cluster bombardment of graphite: molecular dynamics study of penetration and damage. Nucl Instrum Methods Phys Res 145(4): 503–508 (1998)
Insepov Z, Manory Z, Matsuo J, Yamada I. Proposal for a hardness measurement technique without indentor by gascluster-beam bombardment. Phys Rev B 61(13): 8744–8752 (2000)
Yamaguchi Y, Gspann J. Large-scale molecular dynamics simulations of cluster impact and erosion processes on a diamond surface. Phys Rev B 66(15): 155408 (2002)
Aokia T, Matsuo J. Surface structure dependence of impact processes of gas cluster ions. Nucl Instrum Methods Phys Res 216: 185–190 (2004)
Han X, Gan Y X. Analysis the complex interaction among flexible nanoparticles and materials surface in the mechanical polishing process. Appl Surf Sci 257(8): 3363–3373 (2011)
Chen R L, Liang M, Luo J B, Lei H, Hu X. Comparison of surface damage under the dry and wet impact: Molecular dynamics simulation. Appl Surf Sci 258(5): 1756–1761 (2011)
Chen R L, Wu Y H, Lei H, Jiang R R, Liang M. Study of material removal processes of the crystal silicon substrate covered by an oxide film under a silica cluster impact: Molecular dynamics simulation. Appl Surf Sci 305(16): 609–616 (2014)
Lv J, Bai M, Cui W, Li X. The molecular dynamic simulation on impact and friction characters of nanofluids with many nanoparticles system. Nanoscale Res Lett 6(1): 1–8 (2011)
Aminfar H, Razmara N, Mohammadpourfard M. On flow characteristics of liquid-solid mixed-phase nanofluid inside nanochannels. J Appl Math Mech 35(12): 1541–1554 (2014)
Algara-Siller G, Lehtinen O, Wang F C, Nair R R, Kaiser U, Wu H A, Geim A K, Grigorieva I V. Square ice in graphene nanocapillaries. Nature 519(7544): 443–5 (2014)
Bourg I C, Steefel C I. Molecular dynamics simulations of water structure and diffusion in silica nanopores. J Phys Chem C 116(21): 11556–11564 (2012)
Vollmayr K, Kob W, Binder K. Cooling-rate effects in amorphous silica: a computer-simulation study. Phys Rev B 54(22): 15808–15827 (1996)
Rovere M, Ricci M A, Vellati D, Bruni F. A molecular dynamics simulation of water confined in a cylindrical SiO2 pore. J Chem Phys 108(23): 9859–9867 (1998)
Watanabe T, Fujiwara H, Noguchi H, Hoshino T, Ohdomari I. Novel interatomic potential energy function for Si, O mixed systems. Jpn J Appl Phys 38(38): 366–369 (1999)
Jorgensen W J, Chandrasekhar J, Madura J D, Impey R W, Klein M L. Comparison of simple potential functions for simulating liquid water. J Chem Phys 79(2): 926–935 (1983)
Tang C Y, Zhang L C. A molecular dynamics analysis of the mechanical effect of water on the deformation of silicon monocrystals subjected to nano-indentation. Nanotechnology 16(1): 15–20 (2005)
Xu J, Luo J B, Lu X C, Wang L L, Pan G S, Wen S Z. Atomic scale deformation in the solid surface induced by nanoparticle impacts. Nanotechnology 16(6): 859–864 (2005)
Evans D J, Hoover W G, Failor B H, Moran B, Ladd A J C. Nonequilibrium molecular dynamics via Gauss’s principle of least constraint. Phys Rev A 28(2): 1016–1021 (1983)
Chen R L, Luo J B, Guo D, Lei H. Dynamic phase transformation of crystalline silicon under the dry and wet impact studied by molecular dynamics simulation. J Appl Phys 108(108): 073521 (2010)
Hu J Z, Merkle L D, Menoni C S, Spain I L. Crystal data for high-pressure phases of silicon. Phys Rev B 34(7): 4679–4684 (1986)
Acknowledgements
The work was financially supported by the National Natural Science Foundation of China (Nos. 51375291 and 91323302); Initial Research Funds for Young Teachers of Donghua University (No. 103-07-0053016); Innovation Program of Shanghai Municipal Education Commission (No. 13YZ004). The authors would also like to thank Prof. Hong Lei at Shanghai University and Prof. Xinchun Lu at Tsinghua University for their generous supports.
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Ruling CHEN. He received his Ph.D. degree in mechanical engineering from the Tsinghua University in China in 2009. Now he is an associate professor at Donghua University. His research areas cover the nanotribology, ultra-precision surface machining/etc.
Di ZHANG. Master student in inorganic chemistry major at the Shanghai University. His research interest is molecular dynamics simulation and ultraprecision surface machining.
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Chen, R., Zhang, D. & Wu, Y. Study on the influence of standoff distance on substrate damage under an abrasive water jet process by molecular dynamics simulation. Friction 6, 195–207 (2018). https://doi.org/10.1007/s40544-017-0168-4
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DOI: https://doi.org/10.1007/s40544-017-0168-4