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Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material

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Abstract

A simple and large-scale two-steps polyol process was used to simultaneously synthesize nano and micro Ag particle pastes, which were used to joint Ag-plated Cu sheets. It is found the optimized size distribution of the Ag particles and less organics remainder highly improved the shear strength and conductivity of the sintered Ag paste. After sintering at 200 °C, a shear strength of over 40 MPa and a resistivity of 5.1 μΩ cm were achieved by using a paste composed by nano-Ag particles (AgNPs) with the diameter below 800 nm and micro-Ag particles (AgMPs) with the diameter of 1.5–4.2 μm under a small sintering pressure of 0.4 MPa. In contrast, the Ag paste including particles with unsatisfied size distribution resulted in low shear strengths due to inhomogeneous sintering and the presence of large voids. These results are superior to those obtained with only AgNP pastes and suggested that the Ag paste composed of both the AgNPs and AgMPs with suitable ratio and size distribution will be an excellent die-attachment material in microelectronic packaging.

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Acknowledgments

The work is partly supported by the Japan Society for the Promotion of Science Grant-in-Aid for Scientific Research (Grant No. 24226017). The authors would like to thank Jun Wang and Tsukasa Takahashi for their help and support in experimental work.

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Authors and Affiliations

  1. Institute of Scientific and Industrial Research, Osaka University, Ibaraki, Osaka, 567-0047, Japan

    Jinting Jiu, Hao Zhang, Shunsuke Koga, Shijo Nagao, Yasuha Izumi & Katsuaki Suganuma

  2. Graduate School of Engineering, Osaka University, Ibaraki, Osaka, 567-0047, Japan

    Hao Zhang & Shunsuke Koga

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  1. Jinting Jiu
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  2. Hao Zhang
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  3. Shunsuke Koga
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  4. Shijo Nagao
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  5. Yasuha Izumi
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  6. Katsuaki Suganuma
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Correspondence to Jinting Jiu.

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Jiu, J., Zhang, H., Koga, S. et al. Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material. J Mater Sci: Mater Electron 26, 7183–7191 (2015). https://doi.org/10.1007/s10854-015-3343-2

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  • DOI: https://doi.org/10.1007/s10854-015-3343-2

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