Abstract
The influences of annealing temperature on the wear properties and electrical conductivity of Cu were studied after processing by high-pressure torsion (HPT). The annealing of Cu specimens processed by HPT leads to an increase in electroconductivity and a decrease in the wear rate. It is apparent that a nanotribolayer at the surface induced during wear sliding plays a more significant role than the ultrafine-grained structure. A slight increase was observed in the microhardness of HPT copper specimens upon annealing at a relatively low temperature (100 °C), and this is most likely due to a change in texture. The annealing leads to an increase in the Taylor factor by ~5 %, which is in good agreement with the increase in the microhardness level which is also by ~5 %. It is apparent that low-temperature annealing of HPT copper may produce optimal properties of the specimens including high strength and electroconductivity with a lower wear rate.
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Acknowledgements
This study was supported by the Ministry of Education and Science, Russia, under Grant No. 14.A18.21.1986, and in part by the European Research Council under ERC Grant Agreement No. 267464-SPDMETALS. The authors are grateful to the personnel of the Joint Research Centre, Belgorod State University, for their assistance with instrumental analysis.
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Zhilyaev, A.P., Shakhova, I., Belyakov, A. et al. Effect of annealing on wear resistance and electroconductivity of copper processed by high-pressure torsion. J Mater Sci 49, 2270–2278 (2014). https://doi.org/10.1007/s10853-013-7923-3
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DOI: https://doi.org/10.1007/s10853-013-7923-3