Skip to main content
Log in

Effect of annealing on wear resistance and electroconductivity of copper processed by high-pressure torsion

  • Published:
Journal of Materials Science Aims and scope Submit manuscript

Abstract

The influences of annealing temperature on the wear properties and electrical conductivity of Cu were studied after processing by high-pressure torsion (HPT). The annealing of Cu specimens processed by HPT leads to an increase in electroconductivity and a decrease in the wear rate. It is apparent that a nanotribolayer at the surface induced during wear sliding plays a more significant role than the ultrafine-grained structure. A slight increase was observed in the microhardness of HPT copper specimens upon annealing at a relatively low temperature (100 °C), and this is most likely due to a change in texture. The annealing leads to an increase in the Taylor factor by ~5 %, which is in good agreement with the increase in the microhardness level which is also by ~5 %. It is apparent that low-temperature annealing of HPT copper may produce optimal properties of the specimens including high strength and electroconductivity with a lower wear rate.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6

Similar content being viewed by others

References:

  1. Valiev RZ, Islamgaliev RK, Alexandrov IV (2000) Bulk nanostructured materials from severe plastic deformation. Prog Mater Sci 45:103–189

    Article  Google Scholar 

  2. Valiev RZ, Sabirov I, Zhilyaev AP, Langdon TG (2012) Bulk nanostructured metals for innovative applications. JOM 64:1134–1142

    Article  Google Scholar 

  3. Faghihi S, Zhilyaev AP, Szpunar JA, Azari F, Vali H, Tabrizian M (2007) Nanostructuring of a titanium material by high-pressure torsion improves pre-osteoblast attachment. Adv Mater 19:1069–1073

    Article  Google Scholar 

  4. Shangina DV, Bochvar NR, Dobatkin SV (2010) Structure and properties of Cu–Cr alloys subjected to shear under pressure and subsequent heating. Russ Metall (Metally) 11:1046–1052

    Article  Google Scholar 

  5. Shangina DV, Maksimenkova YuM, Bochvar NR, Dobatkin SV (2011) Behavior of an ultrafine-grained Cu–Zr alloy in heating, Russian Metallurgy (Metally). Russ Metall (Metally) 11:1069–1073

    Article  Google Scholar 

  6. Dopita M, Janeček M, Kužel R, Seifert HJn, Dobatkin S (2010) Microstructure evolution of CuZr polycrystals processed by high-pressure torsion. J Mater Sci 45:4631–4644. doi:10.1007/s10853-010-4643-9

    Article  Google Scholar 

  7. Rigney DA (1988) Sliding wear of metals. Ann Rev Mater Sci 18:141–163

    Article  Google Scholar 

  8. Emge A, Karthikeyan S, Kim HJ, Rigney DA (2007) The effect of sliding velocity on the tribological behavior of copper. Wear 263:614–618

    Article  Google Scholar 

  9. Emge A, Karthikeyan S, Rigney DA (2009) The effects of sliding velocity and sliding time on nanocrystalline tribolayer development and properties in copper. Wear 267:562–567

    Article  Google Scholar 

  10. Rigney D, Karthikeyan S (2010) The evolution of tribomaterial during sliding: a brief introduction. Tribol Lett 39:3–7

    Article  Google Scholar 

  11. Zhilyaev AP, Shakhova I, Belyakov A, Kaibyshev R, Langdon TG (2013) Wear resistance and electroconductivity in copper processed by severe plastic deformation. Wear 305:89–99

    Article  Google Scholar 

  12. Komura S, Horita Z, Nemoto M, Langdon TG (1999) Influence of stacking fault energy on microstructural development in equal-channel angular pressing. J Mater Res 14:4044–4050

    Article  Google Scholar 

  13. Dobatkin SV, Szpunar JA, Zhilyaev AP, Cho J-Y, Kuznetsov AA (2007) Effect of the route and strain of equal-channel angular pressing on structure and properties of oxygen-free copper. Mater Sci Eng A 462:132–138

    Article  Google Scholar 

  14. Huang WH, Chang L, Kao PW, Chang CP (2001) Effect of die angle on the deformation texture of copper processed by equal channel angular extrusion. Mater Sci Eng A 307:113–118

    Article  Google Scholar 

  15. Miyamoto H, Erb U, Koyama T, Mimaki T, Vinogradov A, Hashimoto S (2004) Microstructure and texture development of copper single crystals deformed by equal-channel angular pressing. Philos Mag Lett 84:235–243

    Article  Google Scholar 

  16. Dalla Torre F, Lapovok R, Sandlin J, Thomson PF, Davies CHJ, Pereloma EV (2004) Microstructures and properties of copper processed by equal channel angular extrusion for 1–16 passes. Acta Mater 52:4819–4832

    Article  Google Scholar 

  17. Furukawa M, Fukuda Y, Oh-ishi K, Horita Z, Langdon TG (2006) An investigation of deformation in copper single crystals using equal-channel angular pressing. Mater Sci Forum 503–504:113–118

    Article  Google Scholar 

  18. Lugo N, Llorca N, Cabrera JM, Horita Z (2008) Microstructures and mechanical properties of pure copper deformed severely by equal-channel angular pressing and high pressure torsion. Mater Sci Eng A 477:366–371

    Article  Google Scholar 

  19. Jiang H, Zhu YT, Butt DP, Alexandrov IV, Lowe TC (2000) Microstructural evolution, microhardness and thermal stability of HPT-processed Cu. Mater Sci Eng A 290:128–138

    Article  Google Scholar 

  20. Wetscher F, Vorhauer A, Pippan R (2005) Strain hardening during high pressure torsion deformation. Mater Sci Eng A 410–411:213–216

    Article  Google Scholar 

  21. Horita Z, Langdon TG (2005) Microstructures and microhardness of an aluminium alloy and pure copper after processing by high-pressure torsion. Mater Sci Eng A 410–411:422–425

    Article  Google Scholar 

  22. Swaminathan S, Shankar MR, Rao BC, Compton WD, Chandrasekar S, King AH, Trumble KP (2007) Severe plastic deformation (SPD) and nanostructured materials by machining. J Mater Sci 42:1529–1541. doi:10.1007/s10853-006-0745-9

    Article  Google Scholar 

  23. Wang K, Tao NR, Liu G, Lu J, Lu K (2006) Plastic strain-induced grain refinement at the nanometer scale in copper. Acta Mater 54:5281–5291

    Article  Google Scholar 

  24. Sadykov FA, Barykin NP, Aslanyan IR (1997) The influence of strain-heat processing on copper wear. Wear 212:160–164

    Article  Google Scholar 

  25. Iglesias P, Bermúdez MD, Moscoso W, Chandrasekar S (2010) Influence of processing parameters on wear resistance of nanostructured OFHC copper manufactured by large strain extrusion machining. Wear 268:178184

    Article  Google Scholar 

  26. Zhang YS, Wang K, Han Z, Liu G (2007) Dry sliding wear behaviour of copper with nano-scaled twins. Wear 262:1463–1470

    Article  Google Scholar 

  27. Yao B, Han Z, Lu K (2012) Correlation between wear resistance and subsurface recrystallization structure in copper. Wear 294–295:438–445

    Article  Google Scholar 

  28. Islamgaliev RK, Pekala K, Pekala M, Valiev RZ (1997) The determination of the grain boundary width of ultrafine grained copper and nickel from electrical resistivity measurements. Phys Stat Sol A 162:559–566

    Article  Google Scholar 

  29. Zhilyaev AP, Gimazov AA, Raab GI, Langdon TG (2008) Using high-pressure torsion for the cold-consolidation of copper chips produced by machining. Mater Sci Eng A 486:123–126

    Article  Google Scholar 

  30. Figueiredo RB, Cetlin PR, Langdon TG (2011) Using finite element modeling to examine the flow processes in quasi-constrained high-pressure torsion. Mater Sci Eng A 528:8198–8204

    Article  Google Scholar 

  31. Figueiredo RB, Pereira PHR, Aguilar MTP, Cetlin PR, Langdon TG (2012) Using finite element modeling to examine the temperature distribution in quasi-constrained high-pressure torsion. Acta Mater 60:3190–3198

    Article  Google Scholar 

  32. van den Beukel A (1979) Dislocation production in cold worked copper. Scripta Metal 13:83–86

    Article  Google Scholar 

  33. Rigney DA (1979) Dislocation content at large plastic strains. Scripta Metal 13:353–354

    Article  Google Scholar 

  34. Huang X, Hansen N, Tsuji N (2006) Hardening by annealing and softening by deformation in nanostructured metals. Science 312:249–251

    Article  Google Scholar 

  35. Tang F, Schoeunung JM (2008) Strain hardening in nanocrystalline or ultrafine-grained metals: a mechanistic explanation. Mater Sci Eng A 493:101–103

    Article  Google Scholar 

  36. Su LH, Lu C, Tieu AK, He LZ, Zhang Y, Wexler D (2011) Vacancy-assisted hardening nanostructured metals. Mater Let 65:514–516

    Article  Google Scholar 

  37. Kamikawa N, Huang X, Tsuji N, Hansen N (2009) Strengthening mechanisms in nanostructured high-purity aluminium deformed to high strain and annealed. Acta Mater 57:4198–4208

    Article  Google Scholar 

Download references

Acknowledgements

This study was supported by the Ministry of Education and Science, Russia, under Grant No. 14.A18.21.1986, and in part by the European Research Council under ERC Grant Agreement No. 267464-SPDMETALS. The authors are grateful to the personnel of the Joint Research Centre, Belgorod State University, for their assistance with instrumental analysis.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Alexander P. Zhilyaev.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zhilyaev, A.P., Shakhova, I., Belyakov, A. et al. Effect of annealing on wear resistance and electroconductivity of copper processed by high-pressure torsion. J Mater Sci 49, 2270–2278 (2014). https://doi.org/10.1007/s10853-013-7923-3

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10853-013-7923-3

Keywords

Navigation