Abstract
Elemental (X) additions to Sn-3.5Ag-0.95Cu (SAC3595) solder were developed with minimal (<0.25 wt.%) concentration to avoid pro-eutectic Ag3Sn blades by reducing undercooling (ΔT) and to eliminate thermal-aging-induced embrittlement. Calorimetry and microstructure results on simple Cu/Cu joints identified 0.21Zn, 0.10Mn, and 0.05Al as sufficient to reduce undercooling below that for SAC3595 and to eliminate Ag3Sn blades. A 211°C melting onset for the X = Mn alloys also suggested the discovery of a new quaternary eutectic. Shear testing and microstructure analysis of larger joints showed that 0.05Al and 0.21Zn additions resulted in reduced as-soldered strength (30 MPa), like Sn-0.95Cu, but all joints showed ductile failure at about 30 MPa after 1000 h at 150°C.
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Acknowledgements
The authors are grateful to the Materials Preparation Center of the Ames Laboratory for experimental assistance in solder alloy and wire preparation. Appreciation also is due to Peter Olsen for metallographic preparation and analysis of the solder joint sample microstructures. Support for this work is gratefully acknowledged from Iowa State University Research Foundation through the Institute for Physical Research and Technology, Iowa State University and from Nihon-Superior, Inc. on a work for others contract through Ames Lab contract no. DE-AC02-07CH11358.
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Anderson, I.E., Walleser, J.W., Harringa, J.L. et al. Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design. J. Electron. Mater. 38, 2770–2779 (2009). https://doi.org/10.1007/s11664-009-0936-7
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DOI: https://doi.org/10.1007/s11664-009-0936-7