Chemical mechanical polishing as a toolbox for thin film magnetic head manufacturing H. van HeerenT. BertensK. Attenborough Pages: 155 - 158
Surface roughness control by energy shift in deep X-ray lithography Y. ChengC.-N. ChenJ. T. Sheu Pages: 163 - 166
Study of silicon backside damage in deep reactive ion etching for bonded silicon–glass structures Y. YoshidaM. KumagaiK. Tsutsumi Pages: 167 - 170
High-aspect-ratio microstructures fabricated by X-ray lithography of polymethylsilsesquioxane-based spin-on glass thick films Y. LiuT. CuiJ. Goettert Pages: 171 - 175
Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection M. FeilC. AlderH. Spöhrle Pages: 176 - 182
Mechanical behavior of aluminum foils as micro structural material under low velocity impact loading T. AuzanneauC. Sato Pages: 183 - 187
Injection molding for microstructures controlling mold-core extrusion and cavity heat-flux C. YanM. NakaoY. Hatamura Pages: 188 - 191
Restrictions in the design of gear wheel components and drives for micro technology A. AlbersN. BurkardtJ. Marz Pages: 192 - 196
A new approach for handling and transferring of thin semiconductor materials J. BagdahnH. KnollM. Petzold Pages: 204 - 209
Uncertainty in measurement of semiconductor piezoresistive sensors P. L. P. HoaG. GerlachG. Suchaneck Pages: 210 - 214
Numerical simulation of thermal distortions in deep and ultra deep X-ray lithography S. AchenbachF. J. PantenburgJ. Mohr Pages: 220 - 224
