Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold–solder interconnection Yoon-Chul SohnJin Yu Rapid Communications 01 August 2005 Pages: 1931 - 1934
Mg–Ca–Zn bulk metallic glasses with high strength and significant ductility X. GuG. J. ShifletS. J. Poon OriginalPaper 01 August 2005 Pages: 1935 - 1938
Benefits of mild wet milling of the intermediates for the synthesis of phase-pure Z-type hexaferrite Jadambaa TemuujinMasami AoyamaHiroshi Kishi OriginalPaper 01 August 2005 Pages: 1939 - 1942
Amorphization of cristobalite at high temperature in vacuum Chang-Ming XuS. W. WangJ. K. Guo OriginalPaper 01 August 2005 Pages: 1943 - 1946
Effect of solid solution impurities on dislocation nucleation during nanoindentation D. F. BahrG. Vasquez OriginalPaper 01 August 2005 Pages: 1947 - 1951
REVIEWS Effects of sub-ångstrom (pico-scale) structure of surfaces on adhesion, friction, and bulk mechanical properties Jacob IsraelachviliNobuo MaedaMustafa Akbulut OriginalPaper 01 August 2005 Pages: 1952 - 1972
Sodium ion conduction in plastic phases: Dynamic coupling of cations and anions in the picosecond range D. WilmerH. FeldmannJ. Combet Outstanding Meeting Paper 01 August 2005 Pages: 1973 - 1978
Simulated soft tissue nanoindentation: A finite element study Shikha GuptaFernando CarrilloChristian Puttlitz Articles 01 August 2005 Pages: 1979 - 1994
Microchannel molding: A soft lithography-inspired approach to micrometer-scale patterning Christopher R. MartinIlhan A. Aksay OriginalPaper 01 August 2005 Pages: 1995 - 2003
Nanoindentation method for determining the initial contact and adhesion characteristics of soft polydimethylsiloxane Yifang CaoDehua YangWole Soboyejoy OriginalPaper 01 August 2005 Pages: 2004 - 2011
Evidence for extensive grain boundary meander and overgrowth of substrate grain boundaries in high critical current density ex situ YBa2Cu3O7−x coated conductors D. M. FeldmannD. C. LarbalestierE. D. Specht OriginalPaper 01 August 2005 Pages: 2012 - 2020
Competing fracture modes in brittle materials subject to concentrated cyclic loading in liquid environments: Monoliths Yu ZhangSanjit BhowmickBrian R. Lawn OriginalPaper 01 August 2005 Pages: 2021 - 2029
Investigation of the crystallization mechanisms in indium molybdenum oxide films by vacuum annealing Shi-Yao SunJow-Lay HuangDing-Fwu Lii OriginalPaper 01 August 2005 Pages: 2030 - 2037
Non-equilibrium microstructure and thermal stability of plasma-sprayed Al–Si coatings K. H. BaikH. K. SeokP. S. Grant OriginalPaper 01 August 2005 Pages: 2038 - 2045
Effects of elevated temperature annealing on the structure and hardness of copper/niobium nanolayered films A. MisraR. G. Hoagland OriginalPaper 01 August 2005 Pages: 2046 - 2054
Comparative study of microstructural properties for YBa2Cu3O7 films on single-crystal and Ni-based metal substrates Y. LinH. WangQ. X. Jia OriginalPaper 01 August 2005 Pages: 2055 - 2060
Neutron Rietveld analysis for optimized CaMgSi2O6:Eu2+ and its luminescent properties Won Bin ImYong-Il KimKyeong Youl Jung OriginalPaper 01 August 2005 Pages: 2061 - 2066
Dielectric and piezoelectric properties of niobium-modified BiInO3–PbTiO3 perovskite ceramics with high Curie temperatures Shujun ZhangRu XiaRobert F. Speyer OriginalPaper 01 August 2005 Pages: 2067 - 2071
Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes C. C. WeiC. Y. Liu OriginalPaper 01 August 2005 Pages: 2072 - 2079
Nanoindentation analysis of mechanical properties of low to ultralow dielectric constant SiCOH films Lugen WangM. GanorAlfred Grill OriginalPaper 01 August 2005 Pages: 2080 - 2093
Spherical indentation creep following ramp loading Michelle L. Oyen OriginalPaper 01 August 2005 Pages: 2094 - 2100
High barrier effects of (0001̄)(0001̄) zinc oxide bicrystals: Implication for varistor ceramics with inversion boundaries Jong-Sook LeeJoachim Maier OriginalPaper 01 August 2005 Pages: 2101 - 2109
Density- and hardness-optimized pressureless sintered and post-hot isostatic pressed B4C Namtae ChoZhihao BaoRobert F. Speyer OriginalPaper 01 August 2005 Pages: 2110 - 2116
Microstructural evolution of an ultrafine-grained cryomilled Al 5083 alloy during thermomechanical processing David WitkinBing Q. HanEnrique J. Lavernia OriginalPaper 01 August 2005 Pages: 2117 - 2126
Synthesis of oriented BiFeO3 thin films by chemical solution deposition: Phase, texture, and microstructural development F. TyholdtS. JørgensenA. E. Gunnæs OriginalPaper 01 August 2005 Pages: 2127 - 2139
Nanotubes patterned thin films of barium-strontium titanate Xuezheng WeiAlexander L. VasilievNitin P. Padture OriginalPaper 01 August 2005 Pages: 2140 - 2147
Ferromagnetic cobalt nanodots, nanorices, nanowires and nanoflowers by polyol process Seung I. ChaChan B. MoSoon H. Hong OriginalPaper 01 August 2005 Pages: 2148 - 2153
Investigation on carbonizing behaviors of nanometer-sized Cr2O3 particles dispersed on alumina particles by metalorganic chemical vapor deposition in fluidized bed Hao-Tung LinJow-Lay HuangWen-Cheng J. Wei OriginalPaper 01 August 2005 Pages: 2154 - 2160
Mechanical properties of intermetallic compounds in the Au–Sn system R. R. ChromikD. N. WangR. P. Vinci OriginalPaper 01 August 2005 Pages: 2161 - 2172
Elastic deformation of coating/substrate composites in axisymmetric indentation M. SakaiJ. ZhangA. Matsuda OriginalPaper 01 August 2005 Pages: 2173 - 2183
Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration Yeh-Hsiu LiuKwang-Lung Lin OriginalPaper 01 August 2005 Pages: 2184 - 2193
Critical examination of the two-slope method in nanoindentation M. TroyonL. Huang OriginalPaper 01 August 2005 Pages: 2194 - 2198
Synthesis of water-soluble silicon oxide material by sol-gel reaction in tetraalkoxysilane-aminoalkyltrialkoxysilane binary system Yoshiro KanekoNobuo IyiHisanao Usami OriginalPaper 01 August 2005 Pages: 2199 - 2204
Effects of Cu contents in Sn–Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface D. Q. YuC. M. L. WuJ. K. L. Lai OriginalPaper 01 August 2005 Pages: 2205 - 2212
Tensile creep behavior in lutetia-doped silicon nitride ceramics Toshiyuki NishimuraNaoto HirosakiJian-Wu Cao OriginalPaper 01 August 2005 Pages: 2213 - 2217
Adhesion of chemical vapor deposited boron carbo-nitride to dielectric and copper films E. R. EngbrechtP. R. FitzpatrickJ. G. Ekerdt OriginalPaper 01 August 2005 Pages: 2218 - 2224
Representative strain of indentation analysis Nagahisa OgasawaraNorimasa ChibaXi Chen OriginalPaper 01 August 2005 Pages: 2225 - 2234
Erratum: “Thermal stability enhancement in nanostructured Cu films containing insoluble tungsten carbides for metallization” [J. Mater. Res. 20, 1379 (2005)] J. P. ChuY. Y. HsiehT. Mahalingam Errata 01 August 2005 Pages: 2235 - 2235