High temperature lead-free solder for microelectronics Frank W. GayleGary BeckaChris Olson Overview Pages: 17 - 21
Creep properties of Sn-Ag solder joints containing intermetallic particles S. ChoiJ. G. LeeJ. P. Lucas Research Summary Pages: 22 - 26
Pb-free solders for flip-chip interconnects D. R. FrearJ. W. JangC. Zhang Research Summary Pages: 28 - 33
Growth of η phase scallops and whiskers in liquid tin-solid copper reaction couples Robert GaglianoMorris E. Fine Overview Pages: 33 - 38
Tin pest in Sn-0.5 wt.% Cu lead-free solder Yoshiharu KariyaNaomi WilliamsWilliam Plumbridge Research Summary Pages: 39 - 41
Copper interconnects for semiconductor devices Sailesh M. MerchantSeung H. KangTom Mountsier Overview Pages: 43 - 48
Advances in high-k dielectric gate materials for future ULSI devices Rajnish K. SharmaAshok KumarJohn M. Anthony Overview Pages: 53 - 55