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Recent progress in Pb-free solders and soldering technologies

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  • Lead- Free Solder
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Authors and Affiliations

  1. IBM T.J. Watson Research Centert, Yorktown Heights, NY

    Sung K. Kang (a Research Staff Member, the advisor)

  2. JOM from the Electronic Packaging and Interconnection Materials Committee of the Electronic, Magnetic, Photonic Materials Division of TMS, USA

    Sung K. Kang (a Research Staff Member, the advisor)

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  1. Sung K. Kang
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Kang, S.K. Recent progress in Pb-free solders and soldering technologies. JOM 53, 16 (2001). https://doi.org/10.1007/s11837-001-0096-6

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  • DOI: https://doi.org/10.1007/s11837-001-0096-6

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