Abstract
The creep behavior of the eutectic tin-silver joints and tin-silver composite solder joints containing 20 vol.% of Cu6Sn5, Ni3Sn4, and FeSn2 intermetallic reinforcements introduced by in-situ methods was investigated. These creep tests were carried out using single shear lap solder joints at room temperature, 85°C, and 125°C. The creep resistance was similar in magnitude for all alloys, and with increasing temperature, the stressexponents decreased in a manner consistent with power-law breakdown behavior. The FeSn2 intermetallic reinforced composite solder was found to be the most creep-resistant alloy at room temperature. Creep failure was observed to occur within the solder matrix in all these solder joints. Although a detailed analysis of the processes involved was difficult because of smearing of the features in the fracture surface, there were indications of grain-boundary separation, ductile fracture, and interfacial separation.
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References
B.P. Richards et al., Lead-Free Soldering (London: U.K. Department of Trade and Industry, 1999).
P.T. Vianco and D.R. Frear, JOM, 45 (7) (1993), p. 14.
H. Mavoori et al., J. Electron. Mater., 26 (7) (1997), p. 783.
S. Chadaet al., Soldering & Surface Mount Technology (26) (July 9, 1997).
M. McCormack and S. Jin, 1994 IEEE/CPMT Int. Electronics Manufacturing Technology Symposium (Piscataway, NJ: IEEE, 1994), p. 7.
W. Yang, L.E. Felton, and R.W. Messler, Jr., J. Electron. Mater., 24 (10) (1995), p. 1465.
A.W. Gibson et al., Design & Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1997), p. 97.
S.L. Choi et al., Design & Reliability of Solders and Solder Interconnections, ed. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1997), p. 241.
A.W. Gibson et al., IEEE 5th International Symposium on Electronics and the Environment (Piscataway, NJ: IEEE, 1997), p. 246.
S. Choi et al., J. Electron. Mater., 2 (10) (2000), p. 1249.
M.D. Mathew, S. Movva, and K.L. Murty, Key Engineering Materials, 171–174 (2000), p. 655.
H. Yang et al., 1996 46th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 1996), p. 1136.
J. Liang et al., Mater. Res. Soc. Symp. Proc., Vol. 445 (Warrendale, PA: MRS, 1997), p. 307.
R. Darveaux and K. Banerji, 1992 42nd Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 1992), p. 538.
V.I. Igoshev et al., J. Electron. Mater., 27 (12) (1998), p. 1367.
D.R. Frear, JOM, 48 (5) (1996), p. 49.
S. Choi et al., J. Electron. Mater., 28 (11) (1999), p. 1209.
J.P. Lucas et al., J. Electron. Mater., 28 (11) (1999), p. 1268.
J. McDougall et al., Mater. Sci. Eng., A285 (2000), p. 25.
H.D. Blair et al., 1996 IEEE/CPMT Int. Electron. Manuf. Technol. Symp. (Piscataway, NJ: IEEE, 1996), p. 282.
V.I. Igoshev and J.I. Kleiman, J. Electron. Mater., 29 (2) (2000), p. 244.
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For more information, contact K.N. Subramanian, Michigan State University, Department of Materials Science and Mechanics, 3536 Engineering Building, East Lansing, Michigan 48824-1226; (517) 353-5397; fax (517) 353-9842; e-mail subraman@egr.msu.edu.
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Choi, S., Lee, J.G., Guo, F. et al. Creep properties of Sn-Ag solder joints containing intermetallic particles. JOM 53, 22–26 (2001). https://doi.org/10.1007/s11837-001-0098-4
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DOI: https://doi.org/10.1007/s11837-001-0098-4