Educators lead increases in 1998 U.S. Engineering salaries Tammy M. Beazley Professional Affairs Pages: 10 - 11
Metallurgical techniques for more reliable integrated circuits S. H. KangJ. W. Morris Jr.A. S. Oates Overview Pages: 16 - 18
Materials challenges in interconnection: Trade-offs for rapid deployment Kris FrutschyZezhong FuRyan Vogt Design Pages: 19 - 21
A metallurgical assessment of SnPbAg solder for GaAs power devices J. M. Parsey Jr.S. ValocchiK. Kyler Research Summary Pages: 28 - 31
Nondestructive evaluation techniques in semiconductor wafer fabrication Arun R. Srivatsa Commentary Pages: 33 - 33
Characterizing and monitoring thin-film processes with spectroscopic ellipsometry Arun R. SrivatsaCarlos L. Ygartua Overview Pages: 34 - 36