Transport Properties of Ni and PbTe Under Pressure Matthew K. JacobsenRavhi S. KumarAndrew L. Cornelius OriginalPaper 23 February 2012 Pages: 633 - 638
Simultaneous Increases in Electrical Conductivity and Seebeck Coefficient of PEDOT:PSS Films by Adding Ionic Liquids into a Polymer Solution Congcong LiuJingkun XuFangfang Kong OriginalPaper 17 February 2012 Pages: 639 - 645
Preparation of Ag Nanocomposite Tellurite Glass by Solid-State Field-Assisted Diffusion Yan MaJian LinShuhua Lei OriginalPaper 17 February 2012 Pages: 646 - 650
Microstructure, Phase Transition, and Piezoelectric Properties of Cerium-Substituted Bismuth Titanate Nanofibers Bo JiangMinghua TangJohn He OriginalPaper 17 February 2012 Pages: 651 - 655
Forming-Free Reversible Bipolar Resistive Switching Behavior in Al-Doped HfO2 Metal–Insulator–Metal Devices R. MahapatraA. B. HorsfallN.G. Wright OriginalPaper 11 February 2012 Pages: 656 - 659
Grain Boundary Carrier Scattering in ZnO Thin Films: a Study by Temperature-Dependent Charge Carrier Transport Measurements R.V. Muniswami NaiduAryasomayajula SubrahmanyamD.M. Phase OriginalPaper 07 February 2012 Pages: 660 - 664
Structural, Optical, and Electrical Properties of Cobalt-Doped CdS Quantum Dots M. ThambiduraiN. MuthukumarasamyR. Balasundaraprabhu OriginalPaper 11 February 2012 Pages: 665 - 672
Optimization of Phase Formation and Superconducting Properties in MgB2 Prepared by Phase Transformation from MgB4 K. L. TanK. Y. TanS. K. Chen OriginalPaper 09 February 2012 Pages: 673 - 678
Influence of Substrate Temperature on Structural and Thermoelectric Properties of Antimony Telluride Thin Films Fabricated by RF and DC Cosputtering Tianbao ChenPing FanZhaokun Cai OriginalPaper 01 February 2012 Pages: 679 - 683
Effects of Zn/Mg Ratio on the Microstructure and Microwave Dielectric Properties of (Zn1−x Mg x )2SiO4 Ceramics Lingxia LiYucui WangPing Zhang OriginalPaper 10 February 2012 Pages: 684 - 688
Impedance Spectroscopy of Dielectric BaTi5O11 Film Prepared by Laser Chemical Vapor Deposition Method Dongyun GuoTakashi GotoLianmeng Zhang OriginalPaper 23 February 2012 Pages: 689 - 694
Synthesis and Characterization of In2S3 Thin Films Deposited by Chemical Bath Deposition on Polyethylene Naphthalate Substrates O.A. Castelo-GonzálezH.C. Santacruz-OrtegaM. Sotelo-Lerma OriginalPaper 07 January 2012 Pages: 695 - 700
Low-Temperature Sintering and Electromagnetic Properties of NiCuZn/CaTiO3 Composites Haibo YangYanyan YangFen Wang BriefCommunication 18 February 2012 Pages: 701 - 705
Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package K.-O. Lee OriginalPaper 23 February 2012 Pages: 706 - 711
Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing Hae-A-Seul ShinByoung-Joon KimYoung-Chang Joo OriginalPaper 17 February 2012 Pages: 712 - 719
Low-Resistance Cu-Sn Electroplated–Evaporated Microbumps for 3D Chip Stacking M. MurugesanY. OharaM. Koyanagi OriginalPaper 22 February 2012 Pages: 720 - 729
Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects M. L. HuangS. M. ZhouL. D. Chen OriginalPaper 23 February 2012 Pages: 730 - 740
Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading Q. S. ZhuH. Y. LiuJ. K. Shang OriginalPaper 17 February 2012 Pages: 741 - 747
Observations of IMC Formation for Au Wire Bonds to Al Pads John DeLuccaJohn OsenbachFrank Baiocchi OriginalPaper 26 January 2012 Pages: 748 - 756
Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging Kai-Jheng WangJenq-Gong Duh OriginalPaper 11 February 2012 Pages: 757 - 762
Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish Young Min KimJin-Young ParkYoung-Ho Kim OriginalPaper 23 February 2012 Pages: 763 - 773
Investigating the Effects of Lead Forming Parameters on Intermetallic Layer Crack Using the Finite-Element Method J.W.C. ChinC.K. KokM.R. Said OriginalPaper 07 February 2012 Pages: 774 - 781
High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films Gang ChenXiu-Hu SunXu Chen OriginalPaper 08 February 2012 Pages: 782 - 790
Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps Jae-Myeong KimMyeong-Hyeok JeongYoung-Bae Park OriginalPaper 25 January 2012 Pages: 791 - 799
Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys J. P. TuckerD. K. ChanC. A. Handwerker Erratum 22 February 2012 Pages: 800 - 800