Modeling the Power Output of Piezoelectric Energy Harvesters Mahmoud Al AhmadH. N. Alshareef OriginalPaper 30 April 2011 Pages: 1477 - 1484
Statistical Method to Study Thermopower Anisotropy in Small Crystals A. A. AndreevM. I. FedorovV. K. Zaitsev OriginalPaper 16 April 2011 Pages: 1485 - 1489
Numerical Modeling of the Performance of Thermal Interface Materials in the Form of Paste-Coated Sheets Parisa Pour Shahid Saeed AbadiD. D. L. Chung OriginalPaper 23 April 2011 Pages: 1490 - 1500
Density-Functional Study of the Electronic Structure and Optical Properties of Transparent Conducting Oxides In4Sn3O12 and In4Ge3O12 Yun Geng ZhangYuan Xu Wang OriginalPaper 21 April 2011 Pages: 1501 - 1505
Antimony Telluride Thin Films Electrodeposited in an Alkaline Electrolyte W. J. QiuS. H. YangX. B. Zhao OriginalPaper 19 April 2011 Pages: 1506 - 1511
Preparation and Flux-Pinning Properties of Multilayered Yttrium Barium Copper Oxide Thin Films Containing Alternating Barium Zirconate and Yttria Nanostructures Yu LiuGuoping Du OriginalPaper 06 May 2011 Pages: 1512 - 1516
Effect of Constant and Cyclic Current Stressing on the Evolution of Intermetallic Compound Layers T. LaurilaJ. KarppinenM. Paulasto-Kröckel OriginalPaper 16 April 2011 Pages: 1517 - 1526
Interfacial Reactions in Sn-Pb/Ni-8.0 at.%V Couples Sinn-wen ChenYu-ren LinRu-Bo Chang OriginalPaper 23 April 2011 Pages: 1527 - 1532
Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates C. LeinenbachF. ValenzaR. Novakovic OriginalPaper 23 April 2011 Pages: 1533 - 1541
Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples H. F. ZouQ. K. ZhangZ. F. Zhang OriginalPaper 26 April 2011 Pages: 1542 - 1548
Cu Substrates with Different Grain Sizes Jo-Mei WangKai-Jheng WangJenq-Gong Duh OriginalPaper 02 May 2011 Pages: 1549 - 1555
Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution Jing HuTingbi LuoDali Mao OriginalPaper 06 May 2011 Pages: 1556 - 1562
Improvement in Joint Reliability of SiC Power Devices by a Diffusion Barrier Between Au-Ge Solder and Cu/Ni(P)-Metalized Ceramic Substrates Fengqun LangHiroshi YamaguchiHiroshi Sato OriginalPaper 17 May 2011 Pages: 1563 - 1571
Shallow–Deep InGaN Multiple-Quantum-Well System for Dual-Wavelength Emission Grown on Semipolar (\( 11\bar{2}2 \)) Facet GaN Lianshan WangZhiqin LuZhe Chuan Feng OriginalPaper 07 May 2011 Pages: 1572 - 1577
Synthesis of c-Axis Inclined AlN Films in an Off-Center System for Shear Wave Devices Juan XiongHao-Shuang GuHong Xie OriginalPaper 17 May 2011 Pages: 1578 - 1583
Mobility Enhancement Technology for Scaling of CMOS Devices: Overview and Status Yi SongHuajie ZhouHuicai Zhong ReviewPaper Open access 15 May 2011 Pages: 1584 - 1612