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Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples

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Abstract

In the current study, the interfacial microstructures of Sn-Ag/Cu-X alloy (X = Ag, Sn or Zn) couples were investigated. The experimental results confirm that addition of Ag or Zn can effectively suppress the growth of the Cu3Sn layer, while addition of Sn accelerates the growth of the Cu3Sn layer. Meanwhile, the formation of voids is effectively suppressed by alloying the Cu substrate. The disappearance of voids and the absence of the Cu3Sn layer were well explained in terms of the phase diagram and the diffusion flux: the Cu3Sn phase is a nonequilibrium phase based on the Sn-Cu-Zn ternary phase diagram, since a high-Zn region is formed at the Cu6Sn5/Cu-Zn alloy interface; in addition, the high Sn diffusion flux in the Cu6Sn5 can suppress the growth of Cu3Sn and the formation of voids.

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References

  1. T. Laurila, V. Vuorinen, and J.K. Kivilahti, Mater. Sci. Eng. R 49, 1 (2005).

    Article  Google Scholar 

  2. P.L. Liu and J.K. Shang, Scripta Mater. 44, 1019 (2001).

    Article  CAS  Google Scholar 

  3. H.F. Zou, Q.K. Zhang, and Z.F. Zhang, Scripta Mater. 61, 308 (2009).

    Article  CAS  Google Scholar 

  4. C.Y. Oh, H.-R. Roh, Y.M. Kim, J.S. Lee, H.Y. Cho, and Y.-H. Kim, J. Mater. Res. 24, 297 (2009).

    Article  CAS  Google Scholar 

  5. A. Sharif and Y.C. Chan, J. Electron. Mater. 35, 1812 (2006).

    Article  CAS  Google Scholar 

  6. Q.S. Zhu, Z.F. Zhang, J.K. Shang, and Z.G. Wang, Mater. Sci. Eng. A 435–436, 588 (2006).

    Google Scholar 

  7. Z. Chen, M. He, A. Kumar, and G.J. Qi, J. Electron. Mater. 36, 17 (2007).

    Article  Google Scholar 

  8. C.-Y. Yu, K.-J. Wang, and J.-G. Duh, J. Electron. Mater. 39, 230 (2010).

    Article  CAS  Google Scholar 

  9. I. Kaban, K. Khalouk, M. Kohler, W. Hoyer, and J.G. Gasser, J. Electron. Mater. 39, 70 (2010).

    Article  CAS  Google Scholar 

  10. Q.K. Zhang, Q.S. Zhu, H.F. Zou, and Z.F. Zhang, Mater. Sci. Eng. A 527, 1367 (2010).

    Article  Google Scholar 

  11. T. Laurila, V. Vuorinen, and M. Paulasto-Kröckel, Mater. Sci. Eng. R 68, 1 (2010).

    Article  Google Scholar 

  12. J. Yu and J.Y. Kim, Acta Mater. 56, 5514 (2008).

    Article  CAS  Google Scholar 

  13. C.Y. Chou and S.W. Chen, Acta Mater. 54, 2393 (2006).

    Article  CAS  Google Scholar 

  14. K.N. Tu, Solder Joint Technology Materials, Properties, and Reliability (New York: Springer, 2007).

    Google Scholar 

  15. H.C. Bhedwar, K.K. Ray, S.D. Kulkarni, and V. Balasubramanian, Scripta Metall. 6, 919 (1972).

    Article  CAS  Google Scholar 

  16. M. Oh (Doctoral Dissertation, Leigh University, 1994).

  17. A. Paul (Doctoral Dissertation, Technical University of Eindhoven, 2004).

  18. A.M. Gusak and K.N. Tu, Phys. Rev. B 66, 115403 (2002).

    Article  Google Scholar 

  19. N.L. Peterson and S.J. Rothman, Phys. Rev. B 2, 1540 (1970).

    Article  Google Scholar 

  20. R. Hultgren, P.D. Desai, D.T. Hawkins, M. Gleioser, and K.K. Kelley, Selected Values of Thermodynamic Properties of Binary Alloys (Metals Park, OH: ASM International, 1973).

    Google Scholar 

  21. A. Kuper, H. Letaw, J.L. Slifkin, E. Sonder, and C.T. Tomizuka, Phys. Rev. 96, 1224 (1954).

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, People’s Republic of China

    H. F. Zou, Q. K. Zhang & Z. F. Zhang

  2. Capital Aerospace Machinery Company, Beijing, 100076, People’s Republic of China

    H. F. Zou

Authors
  1. H. F. Zou
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  2. Q. K. Zhang
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  3. Z. F. Zhang
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Correspondence to Z. F. Zhang.

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Zou, H.F., Zhang, Q.K. & Zhang, Z.F. Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples. J. Electron. Mater. 40, 1542–1548 (2011). https://doi.org/10.1007/s11664-011-1645-6

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  • DOI: https://doi.org/10.1007/s11664-011-1645-6

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