Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders M.A. DudekN. Chawla OriginalPaper Open access 16 September 2008 Pages: 210 - 220
The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder Christopher KinneyJ.W. Morris Jr.Dave Towne OriginalPaper 11 October 2008 Pages: 221 - 226
Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry Y.K. WuK.L. LinB. Salam OriginalPaper 06 November 2008 Pages: 227 - 230
Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change A. ZamiriT.R. BielerF. Pourboghrat OriginalPaper 19 November 2008 Pages: 231 - 240
Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes Ruihong ZhangFu GuoFeng Tai OriginalPaper 30 October 2008 Pages: 241 - 251
The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates Albert T. WuMing-Hsun ChenCiou-Nan Siao OriginalPaper 07 October 2008 Pages: 252 - 256
An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate Sun-Kyoung SeoSung K. KangHyuck Mo Lee OriginalPaper 10 September 2008 Pages: 257 - 265
Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders Seongjun KimKeun-Soo KimKatsuaki Suganuma OriginalPaper 16 September 2008 Pages: 266 - 272
Temperature-Dependent Phase Segregation in Cu/42Sn-58Bi/Cu Reaction Couples under High Current Density Guangchen XuHongwen HeFu Guo OriginalPaper 07 October 2008 Pages: 273 - 283
Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface Hui ZhaoDinesh Reddy NalagatlaDusan P. Sekulic OriginalPaper 06 November 2008 Pages: 284 - 291
Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies Polina SnugovskyHeather McCormickMarianne Romansky OriginalPaper 07 November 2008 Pages: 292 - 302
Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage J. OsenbachA. AminR. Weachock OriginalPaper 31 December 2008 Pages: 303 - 324
Nature of Growth Pits in Lead Salt Epilayers Grown by Molecular Beam Epitaxy Jiangang MaDonghui LiZhisheng Shi OriginalPaper 10 October 2008 Pages: 325 - 329
Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy R. MahmudiA.R. GeranmayehM. Taghaddosi OriginalPaper 16 October 2008 Pages: 330 - 337
Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow Hsiao-Yun ChenChih Chen OriginalPaper 21 October 2008 Pages: 338 - 344
Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder Chen WeiYongchang LiuChangsheng Ma OriginalPaper 21 October 2008 Pages: 345 - 350
Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression Chang Dong ZouYu Lai GaoJohan Liu OriginalPaper 30 October 2008 Pages: 351 - 355
Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations Wei ZhouLijuan LiuPing Wu OriginalPaper 31 October 2008 Pages: 356 - 364
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications Riko I MadeChee Lip GanChengkuo Lee OriginalPaper 10 October 2008 Pages: 365 - 371
Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion Xi ChenAnmin HuDali Mao OriginalPaper 06 November 2008 Pages: 372 - 378