Compliant Substrates for Heteroepitaxial Semiconductor Devices: Theory, Experiment, and Current Directions J.E. Ayers OriginalPaper Open access 02 July 2008 Pages: 1511 - 1523
Air-Gaps for High-Performance On-Chip Interconnect Part I: Improvement in Thermally Decomposable Template SeongHo ParkSue Ann Bidstrup AllenPaul A. Kohl OriginalPaper 29 July 2008 Pages: 1524 - 1533
Air-Gaps for High-Performance On-Chip Interconnect Part II: Modeling, Fabrication, and Characterization Seongho ParkSue Ann Bidstrup AllenPaul A. Kohl OriginalPaper Open access 25 July 2008 Pages: 1534 - 1546
Interface Engineering and Direct Bonding of Lithium Tantalate Crystals Ilya TorchinskyGil Rosenman OriginalPaper Open access 02 July 2008 Pages: 1547 - 1551
Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits Di LiangAlexander W. FangJohn E. Bowers OriginalPaper 03 June 2008 Pages: 1552 - 1559
Growth and Characterizations of GaN-Based LEDs Grown on Wet-Etched Stripe-Patterned Sapphire Substrates Kar Wei NgJung Min HwangKei May Lau OriginalPaper 26 June 2008 Pages: 1560 - 1564
Effect of Ar+ Radiofrequency Plasma Treatment Conditions on the Interfacial Adhesion Energy Between Atomic-Layer-Deposited Al2O3 and Cu Thin Films in Embedded Capacitors Sung-Cheol ParkYoung-Bae Park OriginalPaper 25 July 2008 Pages: 1565 - 1573
Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste Xu ChenRong LiGuo-Quan Lu OriginalPaper 19 July 2008 Pages: 1574 - 1579
Theoretical Prediction and Experimental Measurement of the Degree of Cure of Anisotropic Conductive Films (ACFs) for Chip-On-Flex (COF) Applications Chang-Kyu ChungYong-Min KwonKyung-Wook Paik OriginalPaper 02 July 2008 Pages: 1580 - 1590
Analysis and Experimental Verification of the Volume Effect in the Reaction Between Zn-Doped Solders and Cu S.C. YangY.W. WangC.R. Kao OriginalPaper 25 July 2008 Pages: 1591 - 1597
Interfacial Intermetallic Growth and Strength of Composite Lead-Free Solder Alloy Through Isothermal Aging V. SivasubramaniamN.S. BoscoJ. Botsis OriginalPaper 29 July 2008 Pages: 1598 - 1604
Morphological Evolution of the Reaction Product at the Sn-9wt.%Zn/Thin-Film Cu Interface Chih-Ming ChenChih-Hao ChenWen-Chiung Su OriginalPaper 08 July 2008 Pages: 1605 - 1610
Electromigration-Induced Void Formation at the Cu5Zn8/Solder Interface in a Cu/Sn-9Zn/Cu Sandwich Shih-Ming KuoKwang-Lung Lin BriefCommunication 02 July 2008 Pages: 1611 - 1617
Large-Scale Correlations in the Orientation of Grains in Lead-Free Solder Joints Julien SylvestreAlexandre Blander OriginalPaper Open access 02 July 2008 Pages: 1618 - 1623
Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization Yi-Shao LaiYing-Ta ChiuJiunn Chen OriginalPaper 02 July 2008 Pages: 1624 - 1630
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test Ning ZhangYaowu ShiXiaoyan Li OriginalPaper 28 June 2008 Pages: 1631 - 1639
A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates Hongqin WangHui ZhaoYiyu Qian OriginalPaper 27 June 2008 Pages: 1640 - 1647
Fabrication of Nickel/Gold Multilayered Shells on Polystyrene Bead Cores by Sequential Electroless Deposition Processes Jun-Ho LeeJun Suk OhJae-Do Nam OriginalPaper 26 June 2008 Pages: 1648 - 1652
