The morphological evolution of the reaction product formed at the Sn-9wt.%Zn/thin-film Cu interface under reflow and solid-state aging was investigated. The Cu thin film was rapidly consumed and converted to CuZn5 and Cu5Zn8 at the interface after reflow for 1 min. Upon increasing reflow time, the Cu5Zn8 compound was transformed into CuZn5, followed by grain ripening. CuZn5 grains grew bigger and the number of grains decreased. During the reflow process, CuZn5 grains showed a round and convex surface morphology. During solid-state aging, a different morphological evolution of CuZn5 grains was observed. The surface morphology of the grains became more planar after solid-state aging for 24 h. In addition, the grain surface fractured severely, implying that a compressive stress was created at the interface. After a longer duration of solid-state aging, the grain surface changed into a more faceted morphology. Potential mechanisms of the morphological evolution and fracture of the CuZn5 grains are also discussed.
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The authors wish to acknowledge the financial support of the National Science Council of Taiwan, ROC through Grant NSC 95-2221-E-005-143. This work is supported in part by the Ministry of Education, Taiwan, ROC under the ATU plan.
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Chen, CM., Chen, CH., Lin, CP. et al. Morphological Evolution of the Reaction Product at the Sn-9wt.%Zn/Thin-Film Cu Interface. J. Electron. Mater. 37, 1605–1610 (2008). https://doi.org/10.1007/s11664-008-0517-1
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DOI: https://doi.org/10.1007/s11664-008-0517-1