Damage Produced in Solder Alloys during Thermal Cycling X.W. LIUW.J. PLUMBRIDGE OriginalPaper 04 July 2007 Pages: 1111 - 1120
Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250°C Sinn-wen ChenChih-chi Chen OriginalPaper 31 July 2007 Pages: 1121 - 1128
Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests Yanghua XiaChuanyan LuXiaoming Xie OriginalPaper 27 July 2007 Pages: 1129 - 1136
Morphology and Pull Strength of Sn-Ag(-Co) Solder Joint with Copper Pad Hiroshi NishikawaAkira KomatsuTadashi Takemoto OriginalPaper 03 August 2007 Pages: 1137 - 1143
Cathodoluminescence Study of InGaN/GaN Quantum-Well LED Structures Grown on a Si Substrate Jun XuLi ChenKei May Lau OriginalPaper 27 July 2007 Pages: 1144 - 1148
Passivation of Surface and Interface States in AlGaN/GaN HEMT Structures by Annealing Hyeongnam KimMichael L. SchuetteJames C. Mabon OriginalPaper 24 July 2007 Pages: 1149 - 1155
Characterization of Non-Alloyed Ohmic Contacts to Si-Implanted AlGaN/GaN Heterostructures for High-Electron Mobility Transistors M. KocanG.A. Umana-MembrenoB.D. Nener OriginalPaper 20 July 2007 Pages: 1156 - 1159
Super-Large Domain Metal-Induced Radially Crystallized Poly-Si Made Using Ni(NO3)2/NH4OH Mixed Solution Chunya WuZhiguo MengHoi Sing Kwok OriginalPaper 18 July 2007 Pages: 1160 - 1165
Very Low Pressure Magnetron Reactive Ion Etching of GaN and Al x Ga1−x N Using Dichlorofluoromethane (Halocarbon 12) P. BatoniK. PatelE. B. Stokes OriginalPaper 10 August 2007 Pages: 1166 - 1173
Nanoscratching of Metallic Thin Films on Silicon Substrate: a Molecular Dynamics Study Tomoaki AkabaneYasushi SasajimaJin Onuki OriginalPaper 29 June 2007 Pages: 1174 - 1180
Carbon Nanotube Thermal Pastes for Improving Thermal Contacts Yunsheng XuChia-Ken LeongD.D.L. Chung OriginalPaper 18 July 2007 Pages: 1181 - 1187
Silver Particle Carbon-Matrix Composites as Thick Films for Electrical Applications Yuan-Chan HsuD.D.L. Chung OriginalPaper Open access 18 July 2007 Pages: 1188 - 1192
Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler S.Y. ChangT.H. ChuangC.L. Yang OriginalPaper 20 July 2007 Pages: 1193 - 1198
Behavior of Anisotropic Conductive Film Joints Bonded with Various Forces under Temperature Fluctuation Jong-Woong KimSeung-Boo Jung OriginalPaper 24 July 2007 Pages: 1199 - 1205
Broadband Dielectric Characterization of a Silicone Elastomer Christian JohanssonMats Robertsson OriginalPaper 26 July 2007 Pages: 1206 - 1210
Studies on Inkjet-Printed Conducting Lines for Electronic Devices Hyun Chul JungSu-Hwan ChoYong-Soo Oh OriginalPaper 24 July 2007 Pages: 1211 - 1218
Properties of Indium-Doped ZnO Films Prepared in an Oxygen-Rich Plasma Hui LiErqing XieYongzhe Zhang OriginalPaper 03 August 2007 Pages: 1219 - 1223
Growth and Characterization of Pulsed-Laser-Deposited Ilmenite–Hematite Thin Films P. KaleP. PadminiR. K. Pandey OriginalPaper 04 July 2007 Pages: 1224 - 1228