Skip to main content
SpringerLink
Log in

Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

Sn3.5Ag4Ti(Ce,Ga) active filler was used for joining alumina with alumina and alumina with copper at 250°C in air. The joining process was done without flux and without the need for pre-metallization of alumina or a protective atmosphere. After mechanical activation of the bonding surfaces of alumina and copper, the filler showed good wetting on both alumina and copper and led to a strong bond between alumina and copper. Through tensile testing, a bonding strength of 23.7 MPa was found in the alumina/copper joint region. The shear strengths for alumina/alumina, copper/copper and alumina/copper joints were 13.5, 14.3, and 10.2 MPa, respectively. The affinity of cerium for oxygen protects titanium from oxidation, giving rise to the reaction of titanium with alumina at such a low temperature. Electron probe microanalyzer (EPMA) elemental mapping revealed that titanium segregates effectively at the alumina/solder interfaces. After aging tests at 200°C and 150°C, a double layer of Cu3Sn and Cu6Sn5 intermetallic compound was formed at the solder/copper interfaces. With an increase of aging periods, the amount of brittle compound in the joints increased and resulted in decreases in the shear strengths of the alumina/copper joints.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

REFERENCES

  1. Y. Yoshino and T. Shibata, J. Am. Ceram. Soc., 75(10), 2756 (1992).

    Article  CAS  Google Scholar 

  2. J. Glazer, Int. Mater. Rev. 40, 65 (1995).

    CAS  Google Scholar 

  3. H. Pulfrich, U.S. Patent 2,163,407 (1939)

  4. H.J. Nolte, U.S. Patent 2,667,432 (1954)

  5. A.J. Chick and L.J. Speck, U.S. Patent. 2,708,787 (1955)

  6. A.J. Moorhead, Adv. Ceram. Mater. 2(2), 159 (1987).

    CAS  Google Scholar 

  7. H. Mizuhara and K. Mally, Weld. J., 64(10), 27 (1985).

    CAS  Google Scholar 

  8. W. Weise, W. Malikowski, and W. Bohm, Verbinden von Keramik mit Keramic oder Metall durch Aktivloten under Argon oder Vakuum, Firmenschrift Degussa Hanau AG., Hanau, Germany

  9. Y.H. Chai, W.P. Weng, and T.H. Chuang, Ceram. Int. 24, 273 (1998).

    Article  CAS  Google Scholar 

  10. T.H. Chuang, M.S. Yeh, and Y.H. Chai, Metall. Mat. Trans. A 31A, 1591 (2000).

    Article  CAS  Google Scholar 

  11. F. Hillen, D. Pickart-Castillo, I.J. Rass, and E. Lugscheider, Weld. Cutting 52(8), E162 (2000)

  12. R.W. Smith, Weld. J. 10, 30 (2001).

    Google Scholar 

  13. S.Y. Chang, L.C. Tsao, M.J. Chiang, C.N. Tung, G.H. Pan, and T.H. Chuang, J. Mater. Eng. Perform. 12(4), 383 (2003).

    Article  CAS  Google Scholar 

  14. S.Y. Chang, M.H. Lu, L.C. Tsao, and T.H. Chuang, Weld. J., 4, 81 (2006).

    Google Scholar 

  15. M. Halvarsson, V. Langer, and S. Vuorinen, Surf. Coat. Technol., 76–77, 358 (1995).

    Article  Google Scholar 

  16. S-Bond Technologies, LLC, Bulletin No. 14.01.05, http://www.s-bond.com (2002)

Download references

ACKNOWLEDGEMENT

Special thanks go to National Science Council (under Grant # NSC94-2216-E-224-003) for sponsorship of this research project.

Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, National Yunlin University of Science & Technology, Touliu, 640, Taiwan

    S.Y. Chang & C.L. Yang

  2. Department of Materials Science and Engineering, National Taiwan University, Taipei, 106, Taiwan

    T.H. Chuang

Authors
  1. S.Y. Chang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. T.H. Chuang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. C.L. Yang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to S.Y. Chang.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Chang, S., Chuang, T. & Yang, C. Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler. J. Electron. Mater. 36, 1193–1198 (2007). https://doi.org/10.1007/s11664-007-0190-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-007-0190-9

Key words

Search

Navigation