Skip to main content
Log in

Characterization of Non-Alloyed Ohmic Contacts to Si-Implanted AlGaN/GaN Heterostructures for High-Electron Mobility Transistors

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

This paper reports results of a study of non-alloyed ohmic contacts on Si-implanted AlGaN/GaN heterostructures, obtained from current–voltage characteristics of transfer-length method (TLM) test structures. It is shown that the measured contact resistance from the Ti/Au/Ni metal contacts, deposited on Si-implanted regions, to the two-dimensional electron gas channel at the AlGaN/GaN heterointerface of the non-implanted region, is formed by three different components: (i) contact resistance between the metal␣and the semiconductor (0.60 ± 0.16 Ω mm), (ii) resistance of the implanted region (0.62 ± 0.03 Ω mm) and (iii) an additional resistance (0.72 ±  0.24 Ω mm) giving a total value of 1.9 ± 0.3 Ω mm. The specific ohmic contact resistance was determined to be (2.4 ± 0.5) × 10−5 Ω cm2.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. S.K. Gandhi, VLSI Fabrication Principles, (John Wiley and Sons, Inc., New York, 1983), pp. 299–369

    Google Scholar 

  2. M.C. Chen, J.K. Sheu, M.L. Lee, C.J. Kao, C.J. Tun, G.C. Chi, J. Electrochem. Soc. 153, G799 (2006)

    Article  CAS  Google Scholar 

  3. X.A. Cao, J.R. LaRoche, F. Ren, S.J. Pearton, J.R. Lothian, R.K. Singh, R.G. Wilson, H.J. Guo, S.J. Pennycook, Solid State Electron. 43, 1235 (1999)

    Article  CAS  Google Scholar 

  4. J.C. Zolper, R.J. Shul, A.G. Baca, R.G. Wilson, S.J. Pearton, R.A. Stall, Appl. Phys. Lett. 68, 2273 (1996)

    Article  CAS  Google Scholar 

  5. J. Burm, K. Chu, W.A. Davis, W.J. Schaff, L.F. Eastman, T.J. Eustis, Appl. Phys. Lett. 70, 464 (1997)

    Article  CAS  Google Scholar 

  6. H. Yu, L. McCarthy, H. Xing, P. Waltereit, L. Shen, S. Keller, S.P. Denbaars, J.S. Speck, U.K. Mishra, Appl. Phys. Lett. 85, 5254 (2004)

    Article  CAS  Google Scholar 

  7. F. Recht, L. McCarthy, S. Rajan, A. Chakraborty, C. Poblenz, A. Corrion, J.S. Speck, U.K. Mishra, IEEE Electr. Device L. 27, 205 (2006)

    Article  CAS  Google Scholar 

  8. S.S. Cohen and G.Sh. Gildenblat, VLSI Electronics Microstructure Science - Metal-Semiconductor Contacts and Devices, ed. N. G. Einspruch (Academic Press, Inc., London, 1986) vol. 13, Chap. 4.3, p. 97

  9. J.F. Ziegler, J.P. Biersack, http://www.srim.org

  10. Y. Furuhashi, S. Yoshida, D. Ozaki, T. Inada, Nucl. Instrum. Meth. B 242, 633 (2006)

    Article  CAS  Google Scholar 

  11. F. Recht, L. McCarthy, S. Keller, C. Poblenz, A. Corrion, J.S. Speck, S.P. DenBaars, and U.K. Mishra, submitted to IEEE Electr. Device L

Download references

Acknowledgements

This work was supported in part by the Australian Research Council Discovery Project under Grant DP0559840 and by grants from the Office of Naval Research and the Defense Advanced Research Projects Agency.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to M. Kocan.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Kocan, M., Umana-Membreno, G., Chung, J. et al. Characterization of Non-Alloyed Ohmic Contacts to Si-Implanted AlGaN/GaN Heterostructures for High-Electron Mobility Transistors. J. Electron. Mater. 36, 1156–1159 (2007). https://doi.org/10.1007/s11664-007-0184-7

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-007-0184-7

Keywords

Navigation