Abstract
This paper reports results of a study of non-alloyed ohmic contacts on Si-implanted AlGaN/GaN heterostructures, obtained from current–voltage characteristics of transfer-length method (TLM) test structures. It is shown that the measured contact resistance from the Ti/Au/Ni metal contacts, deposited on Si-implanted regions, to the two-dimensional electron gas channel at the AlGaN/GaN heterointerface of the non-implanted region, is formed by three different components: (i) contact resistance between the metal␣and the semiconductor (0.60 ± 0.16 Ω mm), (ii) resistance of the implanted region (0.62 ± 0.03 Ω mm) and (iii) an additional resistance (0.72 ± 0.24 Ω mm) giving a total value of 1.9 ± 0.3 Ω mm. The specific ohmic contact resistance was determined to be (2.4 ± 0.5) × 10−5 Ω cm2.
Similar content being viewed by others
References
S.K. Gandhi, VLSI Fabrication Principles, (John Wiley and Sons, Inc., New York, 1983), pp. 299–369
M.C. Chen, J.K. Sheu, M.L. Lee, C.J. Kao, C.J. Tun, G.C. Chi, J. Electrochem. Soc. 153, G799 (2006)
X.A. Cao, J.R. LaRoche, F. Ren, S.J. Pearton, J.R. Lothian, R.K. Singh, R.G. Wilson, H.J. Guo, S.J. Pennycook, Solid State Electron. 43, 1235 (1999)
J.C. Zolper, R.J. Shul, A.G. Baca, R.G. Wilson, S.J. Pearton, R.A. Stall, Appl. Phys. Lett. 68, 2273 (1996)
J. Burm, K. Chu, W.A. Davis, W.J. Schaff, L.F. Eastman, T.J. Eustis, Appl. Phys. Lett. 70, 464 (1997)
H. Yu, L. McCarthy, H. Xing, P. Waltereit, L. Shen, S. Keller, S.P. Denbaars, J.S. Speck, U.K. Mishra, Appl. Phys. Lett. 85, 5254 (2004)
F. Recht, L. McCarthy, S. Rajan, A. Chakraborty, C. Poblenz, A. Corrion, J.S. Speck, U.K. Mishra, IEEE Electr. Device L. 27, 205 (2006)
S.S. Cohen and G.Sh. Gildenblat, VLSI Electronics Microstructure Science - Metal-Semiconductor Contacts and Devices, ed. N. G. Einspruch (Academic Press, Inc., London, 1986) vol. 13, Chap. 4.3, p. 97
J.F. Ziegler, J.P. Biersack, http://www.srim.org
Y. Furuhashi, S. Yoshida, D. Ozaki, T. Inada, Nucl. Instrum. Meth. B 242, 633 (2006)
F. Recht, L. McCarthy, S. Keller, C. Poblenz, A. Corrion, J.S. Speck, S.P. DenBaars, and U.K. Mishra, submitted to IEEE Electr. Device L
Acknowledgements
This work was supported in part by the Australian Research Council Discovery Project under Grant DP0559840 and by grants from the Office of Naval Research and the Defense Advanced Research Projects Agency.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Kocan, M., Umana-Membreno, G., Chung, J. et al. Characterization of Non-Alloyed Ohmic Contacts to Si-Implanted AlGaN/GaN Heterostructures for High-Electron Mobility Transistors. J. Electron. Mater. 36, 1156–1159 (2007). https://doi.org/10.1007/s11664-007-0184-7
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-007-0184-7