Mechanical strength of Sn-3.5Ag-based solders and related bondings Chiang-Ming ChuangPo-Cheng ShihKwang-Lung Lin Regular Issue Paper Pages: 1 - 6
The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates Chiang-Ming ChuangHui-Tzu HungKwang-Lung Lin Regular Issue Paper Pages: 7 - 13
A continuous contact resistance monitoring during the temperature ramp of anisotropic conductive adhesive film joint M. A. UddinY. C. ChanM. O. Alam Regular Issue Paper Pages: 14 - 21
Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates T. H. ChuangH. M. WuS. F. Yen Regular Issue Paper Pages: 22 - 27
Kinetics of the Au-Ni-Sn ternary intermetallic layer redeposition at the solder/under-bump metallurgy interface during aging treatment Jong-Hyun LeeJong-Whan ParkYong-Seog Kim Regular Issue Paper Pages: 28 - 33
Reflow and burn-in of a Sn-20In-0.8Cu ball grid array package with a Au/Ni/Cu pad M. J. ChiangS. Y. ChangT. H. Chuang Regular Issue Paper Pages: 34 - 39
Fiber-alignment shifts in butterfly laser packaging by laser-welding technique: Measurement and finite-element method analysis Y. C. HsuW. K. HuangW. H. Cheng Regular Issue Paper Pages: 40 - 47
Relationship between grain structures and texture of damascene Cu lines Jong-Min PaikKi-Chul ParkYoung-Chang Joo Regular Issue Paper Pages: 48 - 52
Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization Hyoungjae KimHaedo Jeong Regular Issue Paper Pages: 53 - 60
The microstructure characterization of ultrasmall eutectic Bi-Sn solder bumps on Au/Cu/Ti and Au/Ni/Ti under-bump metallization Un-Byoung KangYoung-Ho Kim Regular Issue Paper Pages: 61 - 69
Microstructure and strength of bump joints in photodiode packages Kyung-Seob KimNam-Kyu KimEui-Goo Chang Regular Issue Paper Pages: 70 - 75
Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film Myung Jin YimJin-Sang HwangKyung-Wook Paik Regular Issue Paper Pages: 76 - 82
TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnections H. WangA. GuptaJ. Narayan OriginalPaper Pages: L5 - L5