Abstract
The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-0.1Al solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial IMC layers formed between the Cu and Sn-Zn-Ag-Ga-Al solder, while Cu-Zn and Au-Al-Zn IMCs formed on the Cu/Au substrate. Only the Au-Al-Zn IMC formed at the interface when the electroless Ni-P deposit was the diffusion barrier between Cu and the Au surface layer.
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References
N.-C. Lee, Soldering Surf. Mount Technol. 26, 65 (1997).
S. Jin, JOM 45, 13 (1993).
S.S. Kang and A.K. Sarkhel, J. Electron. Mater. 23, 701 (1994).
M. Abtew and G. Selvaduray, Mater. Sci. Eng. 27, 95 (2000).
B. Salam, N.N. Ekere, and D. Rajkumar, 2001 Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 471–477.
J.S. Hwang and R.M. Vargas, Soldering Surf. Mount Technol. 5, 38 (1990).
F. Hua and J. Glazer, Design & Reliability of Solders and Solder Interconnections, Proc. TMS Annual Meeting (Warrendale, PA: TMS, 1997), pp. 66–74.
J. Glazer, Int. Mater. Rev. 40, 65 (1995).
Z. Moser, J. Dutkiewicz, W. Gasior, and J. Salawa, Bull. Alloy Phase Diagrams 6, 330 (1985).
K.S. Bae and S.J. Kim, J. Electron. Mater. 30, 1452 (2001).
S. Ahat, M. Sheng, and L. Luo, J. Mater. Res. 16, 2914 (2001).
T.Y. Lee, W.J. Choi, K.N. Tu, J.W. Jang, S.M. Kuo, J.K. Lin, D.R. Frear, K. Zeng, and J.K. Kivilahti, J. Mater. Res. 17, 291 (2002).
K. Zeng and K.N. Tu, Mater. Sci. Eng. R 38, 51 (2000).
P. Harris, Soldering Surf. Mount Technol. 11, 46 (1999).
K. Suganuma, K. Niihara, T. Shoutoku, and Y. Nakamura, J. Mater. Res. 13, 2859 (1998).
S.P. Yu, C.L. Liao, and M.H. Hon, J. Mater. Sci. 35, 4217 (2000).
K. Suganuma, T. Murata, H. Noguchi, and Y. Toyoda, J. Mater. Res. 15, 884 (2000).
K.L. Lin and C.L. Shih, J. Electron. Mater. 32, 95 (2003).
K.L. Lin and H.M. Hsu, J. Electron. Mater. 30, 1068 (2001).
S.C. Cheng and K.L. Lin, J. Electron. Mater. 31, 940 (2002).
K.I. Chen and K.L. Lin, J. Electron. Mater. 31, 861 (2002).
C.M. Chuang, T.S. Lui, and L.H. Chen, J. Mater. Sci. 37, 191 (2002).
M. Hansen and K. Anderko, Constitution of Binary Alloys, 2nd ed. (New York: McGraw-Hill, 1985).
R. Hultgren, P.D. Desai, D.T. Hawkins, M. Gleiser, and K.K. Kelley, Selected Values of the Thermodynamic Properties of Binary Alloys (Metals Park, OH: ASM, 1973), pp. 115–822.
Y. Chonan, T. Komiyama, J. Onuki, R. Urao, T. Kimura, and T. Nagano, Mater. Trans., JIM 43, 1887 (2002).
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Chuang, CM., Hung, HT., Liu, PC. et al. The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates. J. Electron. Mater. 33, 7–13 (2004). https://doi.org/10.1007/s11664-004-0287-3
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DOI: https://doi.org/10.1007/s11664-004-0287-3