InP and Si metal-oxide semiconductor structures fabricated using oxygen plasma assisted wafer bonding Markus ForsbergDonato PasquarielloDavid Bergman Regular Issue Paper Pages: 111 - 116
Reactive wetting between molten Sn-Bi and Ni substrate Jou-I LeeSinn-Wen ChenChih-Ming Chen Regular Issue Paper Pages: 117 - 122
Effects of substrate metallization of solder/under-bump metallization interfacial reactions in flip-chip packages during multiple reflow cycles F. ZhangM. LiZ. C. Shao Regular Issue Paper Pages: 123 - 130
Curing kinetics of anisotropic conductive adhesive film Y. C. ChanM. A. UddinH. P. Chan Regular Issue Paper Pages: 131 - 136
Effect of temperature cycling on angular alignment in add/drop filter-module packaging C. S. HsiehJ. M. ChenW. H. Cheng Regular Issue Paper Pages: 137 - 141
Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder Paul T. ViancoJerome A. RejentAlice C. Kilgo Regular Issue Paper Pages: 142 - 151
Microstructures in solder joints between Sn95.5Ag4Cu0.5 solder and Ag/Pd thick film Dewei TianTerho Kutilainen Regular Issue Paper Pages: 152 - 158
Effects of dopant, temperature, and strain rate on the mechanical properties of micrometer gold-bonding wire D. S. LiuY. C. Chao Regular Issue Paper Pages: 159 - 165
Fracture toughness of Cu-Sn intermetallic thin films B. BalakrisnanC. C. ChumT. Cahyadi Regular Issue Paper Pages: 166 - 171
Nonstoichiometric deep levels in Mg-doped GaP epitaxial layers: Effects of pre-annealing of substrates Takenori TannoKen SutoJun-Ichi Nishizawa Regular Issue Paper Pages: 172 - 175
Comparisons using optoelectronic modulation spectroscopy of n-type GaAs epitaxial layers formed on buffer layers prepared at normal and low temperatures Chi-Hsin ChiuJ. G. Swanson Regular Issue Paper Pages: 176 - 183
Nickel silicidation techniques for strained Si1−xGex, Si1−x−yGexCy, and Si1−yCy alloys material-device applications Zhongha ShiDavid OnsongoSanjay K. Banerjee Regular Issue Paper Pages: 184 - 190
Composite substrate material for surface acoustic-wave oscillator Sean WuYeong-Chin ChenMaw-Shung Lee Regular Issue Paper Pages: 191 - 194
Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages T. H. ChuangS. Y. ChangH. M. Wu Regular Issue Paper Pages: 195 - 200