Abstract
The development of a constitutive model for predicting the thermal-mechanical fatigue (TMF) of 95.5Sn-3.9Ag-0.6Cu (wt.%) Pb-free solder interconnects requires the measurement of time-independent mechanical and physical properties. Yield stress was measured over the temperature range of −25–160°C using strain rates of 4.2 × 10−5 s−1 and 8.3 × 10−4 s−1. The yield-stress values ranged from approximately 40 MPa at −25°C to 10 MPa at 160°C for tests performed at 4.2 × 10−5 s−1. The faster strain rate and specimen aging had a limited impact on the yield stress. The true stress/true strain curves indicated that dynamic-recovery and dynamic-recrystallization processes took place in as-cast samples exposed to temperatures of 125°C and 160°C, respectively, while tested at a strain rate of 4.2 × 10−5 s−1. Aging the sample prior to testing, as well as a faster strain rate, mitigated both phenomena. Dynamic Young’s modulus values ranged from 55 GPa at −50°C to 35 GPa at 200°C, while the coefficient of thermal expansion (CTE) increased from approximately 12 × 10−6°C−1 to 24 × 10−6°C−1 for the same temperature range. The aging treatment had little effect on either Young’s modulus or the CTE.
Similar content being viewed by others
References
D. Frear, in Solder Mechanics—A State of the Art Assessment, ed. D. Frear, W. Jones, and K. Kinsman (Warrendale, PA: TMS, 1991), pp. 191–237.
M. Neilsen, S. Burchett, C. Stone, and J. Stephens, A Viscoplastic Theory for Braze Alloys, Sandia Report SAND96-0984 (Albuquerque, NM: Sandia National Laboratories, 1996).
P. Vianco, A. Fossum, M. Neilsen, and S. Burchett, Proc. IPC Works 2000 (Northbrook, IL: IPC, 2000), pp. S-01-3-1–S-01-3-9.
“Standard Test Methods for Compression Testing of Metallic Materials at Room Temperature,” ASTM E9-89A (West Conshohoken, PA: ASTM, 1995), pp. 101–103.
P. Vianco, I. Artaki, and A. Jackson, Proc. Surface Mount Int. (Edina, MN: SMTA, 1994), pp. 437–448.
G. Dieter, Mechanical Metallurgy (New York: McGraw-Hill, 1976), pp. 348–351.
“Standard Test Methods for Young’s Modulus, Tangent Modulus, and Chord Modulus,” ASTM E111-82 (West Conshohoken, PA: ASTM, 1995).
G. Dieter, Mechanical Metallurgy (New York: McGraw-Hill, 1976), pp. 556–558.
International Tin Research Institute, Solder Alloy Data Mechanical Properties of Solders and Soldered Joints, Report 656 (Uxbridge, Middlesex, United Kingdom: International Tin Research Institute, 1986), pp. 12 and 38.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Vianco, P.T., Rejent, J.A. & Kilgo, A.C. Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder. J. Electron. Mater. 32, 142–151 (2003). https://doi.org/10.1007/s11664-003-0185-0
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11664-003-0185-0