Study of electron-scattering mechanism in nanoscale Cu interconnects Choong-Un KimJaeyong ParkRod Augur Special Issue Paper Pages: 982 - 987
Electromigration failure in ultra-fine copper interconnects Nancy L. MichaelChoong-Un KimRod Augur Special Issue Paper Pages: 988 - 993
TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnects H. WangA. GuptaJ. Narayan Special Issue Paper Pages: 994 - 999
Thermomechanical response and stress analysis of copper interconnects E. S. EgeY. -L. Shen Special Issue Paper Pages: 1000 - 1011
Effect of stresses on the evolution of annealing textures in Cu and Al interconnects Dong Nyung LeeHyo Jong Lee Special Issue Paper Pages: 1012 - 1022
In-situ nanoindentation of epitaxial TiN/MgO (001) in a transmission electron microscope A. M. MinorE. A. StachI. Petrov Special Issue Paper Pages: 1023 - 1027
Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films A. K. SikderAshok KumarM. Sanganaria Special Issue Paper Pages: 1028 - 1033
Silicon nitride processing for control of optical and electronic properties of silicon solar cells Bhushan Sopori Special Issue Paper Pages: 1034 - 1042
Light emission from silicon: Some perspectives and applications A. T. FioryN. M. Ravindra Special Issue Paper Pages: 1043 - 1051
Modeling and simulation of emissivity of silicon-related materials and structures N. M. RavindraKrshna RavindraAnthony T. Fiory Special Issue Paper Pages: 1052 - 1058
Deformation and interfacial sliding in back-end interconnect structures in microelectronic devices C. ParkI. DuttaJ. Vella Special Issue Paper Pages: 1059 - 1071
Formation of nickel disilicide using nickel implantation and rapid thermal annealing Chel-Jong ChoiSung-Young ChangK. N. Tu Special Issue Paper Pages: 1072 - 1078
Properties of Bi-doped PbTe layers grown by liquid phase epitaxy under controlled Te vapor pressure Wataru TamuraArata YasudaJun-Ichi Nishizawa Special Issue Paper Pages: 1079 - 1084
Crystallization behavior and ferroelectric properties of PbTiO3/Ba0.85Sr0.15TiO3/PbTiO3 sandwich thin film on Pt/Ti/SiO2/Si substrates Shaobo LiuYanqiu LiMeidong Liu Special Issue Paper Pages: 1085 - 1089
Condensed phase equilibria in transition metal-Ga-Sb systems and predictions for thermally stable contacts to GaSb W. E. LiuS. E. Mohney Special Issue Paper Pages: 1090 - 1099
The impact of deep levels on the photocurrent transients in semi-insulating GaAs M. PavlovićB. ŠantićU. V. Desnica Special Issue Paper Pages: 1100 - 1106
Self-limiting growth of ZrO2 films on a Si(100) substrate using ZrCl4 and O2 under atmospheric pressure Naoyuki TakahashiNaoki YoshiiMasayuki Yoshioka Special Issue Paper Pages: 1107 - 1110
The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—The effect of Ga Kang-I ChenKwang-Lung Lin Special Issue Paper Pages: 1111 - 1116
Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film M. A. UddinM. O. AlamH. P. Chan Special Issue Paper Pages: 1117 - 1124
Recent progress of (Ba,Sr)TiO3 thin films for tunable microwave devices Xinhua ZhuJianmin ZhuChung-Loong Choy Special Issue Paper Pages: 1125 - 1134
Influence of H2- and N2-ambient annealing of indium-tin oxide film on plastic substrate for organic light-emitting diode C. J. HuangW. C. Shih Letter Pages: L9 - L13