1. Foreword

   • Fu Guo
   • Carol A. Handwerker
   • Kejun Zeng

   EditorialNotes 22 October 2008 Pages: 209 - 209

2. Oxidation Behavior of Rare-Earth-Containing Pb-Free Solders

   • M.A. Dudek
   • N. Chawla

   OriginalPaper Open access 16 September 2008 Pages: 210 - 220

3. The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder

   • Christopher Kinney
   • J.W. Morris Jr.
   • Dave Towne

   OriginalPaper 11 October 2008 Pages: 221 - 226

4. Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry

   • Y.K. Wu
   • K.L. Lin
   • B. Salam

   OriginalPaper 06 November 2008 Pages: 227 - 230

5. Anisotropic Crystal Plasticity Finite Element Modeling of the Effect of Crystal Orientation and Solder Joint Geometry on Deformation after Temperature Change

   • A. Zamiri
   • T.R. Bieler
   • F. Pourboghrat

   OriginalPaper 19 November 2008 Pages: 231 - 240

6. Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes

   • Ruihong Zhang
   • Fu Guo
   • Feng Tai

   OriginalPaper 30 October 2008 Pages: 241 - 251

7. The Effects of Solid-State Aging on the Intermetallic Compounds of Sn-Ag-Bi-In Solders on Cu Substrates

   • Albert T. Wu
   • Ming-Hsun Chen
   • Ciou-Nan Siao

   OriginalPaper 07 October 2008 Pages: 252 - 256

8. An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

   • Sun-Kyoung Seo
   • Sung K. Kang
   • Hyuck Mo Lee

   OriginalPaper 10 September 2008 Pages: 257 - 265

9. Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

   • Seongjun Kim
   • Keun-Soo Kim
   • Katsuaki Suganuma

   OriginalPaper 16 September 2008 Pages: 266 - 272

10. Temperature-Dependent Phase Segregation in Cu/42Sn-58Bi/Cu Reaction Couples under High Current Density

    • Guangchen Xu
    • Hongwen He
    • Fu Guo

    OriginalPaper 07 October 2008 Pages: 273 - 283

11. Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface

    • Hui Zhao
    • Dinesh Reddy Nalagatla
    • Dusan P. Sekulic

    OriginalPaper 06 November 2008 Pages: 284 - 291

12. Microstructure, Defects, and Reliability of Mixed Pb-Free/Sn-Pb Assemblies

    • Polina Snugovsky
    • Heather McCormick
    • Marianne Romansky

    OriginalPaper 07 November 2008 Pages: 292 - 302

13. Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage

    • J. Osenbach
    • A. Amin
    • R. Weachock

    OriginalPaper 31 December 2008 Pages: 303 - 324

14. Nature of Growth Pits in Lead Salt Epilayers Grown by Molecular Beam Epitaxy

    • Jiangang Ma
    • Donghui Li
    • Zhisheng Shi

    OriginalPaper 10 October 2008 Pages: 325 - 329

15. Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy

    • R. Mahmudi
    • A.R. Geranmayeh
    • M. Taghaddosi

    OriginalPaper 16 October 2008 Pages: 330 - 337

16. Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow

    • Hsiao-Yun Chen
    • Chih Chen

    OriginalPaper 21 October 2008 Pages: 338 - 344

17. Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder

    • Chen Wei
    • Yongchang Liu
    • Changsheng Ma

    OriginalPaper 21 October 2008 Pages: 345 - 350

18. Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

    • Chang Dong Zou
    • Yu Lai Gao
    • Johan Liu

    OriginalPaper 30 October 2008 Pages: 351 - 355

19. Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations

    • Wei Zhou
    • Lijuan Liu
    • Ping Wu

    OriginalPaper 31 October 2008 Pages: 356 - 364

20. Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

    • Riko I Made
    • Chee Lip Gan
    • Chengkuo Lee

    OriginalPaper 10 October 2008 Pages: 365 - 371

21. Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion

    • Xi Chen
    • Anmin Hu
    • Dali Mao

    OriginalPaper 06 November 2008 Pages: 372 - 378