Features of the Manufacturing Process of Silicon Needles for Cantilevers A. V. NovakV. R. NovakA. V. Rumyantsev OriginalPaper 09 January 2023 Pages: 521 - 527
Application of the Methodology of Energy and Environmental Analysis to Study the Air Removal System of Clean Rooms in Microelectronics M. A. GundartsevV. I. KarakeyanV. P. Sharaeva OriginalPaper 09 January 2023 Pages: 528 - 530
Study of the Influence of Mechanical and Temperature Effects on the Level of Stresses and Deformations in 3D Microassemblies Hermetically Sealed with Two Types of Compounds D. V. VertyanovI. A. BelyakovV. N. Sidorenko OriginalPaper 09 January 2023 Pages: 531 - 538
Cut-Off UV Light Filter to Prevent the Negative Slope of the Soft Lithography Hard Mold Walls T. A. RadzievskayaN. N. IvanovS. A. Tarasov OriginalPaper 09 January 2023 Pages: 539 - 544
TCAD Modeling of Nanoscale FinFET Structures on Bulk Silicon, Taking into Account the Effects of Radiation K. O. PetrosyantsD. S. SilkinXu Zhang OriginalPaper 09 January 2023 Pages: 545 - 551
Investigation of the Robustness of Nanoelectronic Structures Based on Resonant Tunneling Elements A. V. BondarevV. N. Efanov OriginalPaper 09 January 2023 Pages: 552 - 561
Investigation of the Optical Communication Channel Throughput with an Information Receiver in the Form of a Silicon Photomultiplier V. B. ZalesskyI. R. GulakovV. S. Tsymbal OriginalPaper 09 January 2023 Pages: 562 - 566
Formation of IP-Core Libraries in the User IC Design Flow for FPGAs and RSoCs V. M. KhvatovS. V. Gavrilov OriginalPaper 09 January 2023 Pages: 567 - 572
Pathfinder Algorithm Modification for FPGA Routing Stage M. A. ZapletinaS. V. Gavrilov OriginalPaper 09 January 2023 Pages: 573 - 578
Automatic FPGA Placement Configuration for Customer Designs V. I. EnnsS. V. GavrilovR. Zh. Chochaev OriginalPaper 09 January 2023 Pages: 579 - 584
Thin-Film Absorbing Elements of Adapter-Attenuators for HICs A. V. PilkevichV. D. Sadkov OriginalPaper 09 January 2023 Pages: 585 - 591
Modified Predictive Control System of a DC-DC Boost Converter A. A. CherdintsevA. V. ShchaginS. A. Lupin OriginalPaper 09 January 2023 Pages: 592 - 601
A Simple Method to Fit the Parameters of SPICE Models of Transistor-Level ICs in a Temperature Range S. V. ShumarinA. M. Bogachev OriginalPaper 09 January 2023 Pages: 602 - 605
Development of a Sensitive Element of a Micromechanical Accelerometer E. S. KochurinaS. A. AnchutinI. S. Dernov OriginalPaper 09 January 2023 Pages: 606 - 610
Studying the Functioning of the Sensitive Element of a Capacitive Accelerometer with a Sandwich Structure under the Conditions of Parasitic Effects along the Nonworking Axes and Random Vibration Ye Ko Ko AungB. M. SimonovS. P. Timoshenkov OriginalPaper 09 January 2023 Pages: 611 - 618
Parallel-Pipeline Processing of Video Information in Multiprocessing Heterogeneous Systems on a Chip E. S. YanakovaG. T. MacharadzeA. A. Shvachko OriginalPaper 09 January 2023 Pages: 619 - 626
