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Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

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Abstract

Microstructures and fatigue life of SnAgCu and SnAgCu bearing nano-Al particles in QFP (Quad flat package) devices were investigated, respectively. Results show that the addition of nano-Al particles into SnAgCu solder can refine the microstructures of matrix microstructure. Moreover, the nano-Al particles present in the solder matrix, act as obstacles which can create a back stress, resisting the motion of dislocations. In QFP device, it is found that the addition of nano-Al particles can increase the fatigue life by 32% compared with the SnAgCu solder joints during thermal cycling loading.

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Authors and Affiliations

  1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Liang Zhang, Xi-ying Fan, Yong-huan Guo & Cheng-wen He

  2. Department of Materials Science and Engineering, University of California, Los Angeles, CA, 90095, USA

    Liang Zhang

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  1. Liang Zhang
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  2. Xi-ying Fan
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  3. Yong-huan Guo
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  4. Cheng-wen He
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Correspondence to Liang Zhang.

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Zhang, L., Fan, Xy., Guo, Yh. et al. Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices. Electron. Mater. Lett. 10, 645–647 (2014). https://doi.org/10.1007/s13391-014-3190-y

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  • DOI: https://doi.org/10.1007/s13391-014-3190-y

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