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Whisker growth on SnAgCu–xPr solders in electronic packaging

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Abstract

The addition of rare earth Pr into Sn3.8Ag0.7Cu solder results in the formation of PrSn3 phase, which can induce the whiskers growth. After several hours’ exposure at room temperature in air, different morphologies of whiskers appear in the regions of PrSn3 intermetallic compounds. The Pr content and storage time are the main parameters for affecting the whiskers growth at ambient temperature. The oxidation mechanism of PrSn3 phase was used to explain the whiskers growth, the compressive stress is proposed as the driving force for whisker growth.

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Acknowledgments

This study was funded by the Natural Science Foundation of China (51475220) and the State Foundation of Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering) (SKLABFMT-2015-03).

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Authors and Affiliations

  1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Liang Zhang & Fan Yang

  2. State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, 450001, China

    Su-juan Zhong

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  1. Liang Zhang
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  2. Fan Yang
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  3. Su-juan Zhong
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Correspondence to Liang Zhang.

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Zhang, L., Yang, F. & Zhong, Sj. Whisker growth on SnAgCu–xPr solders in electronic packaging. J Mater Sci: Mater Electron 27, 5618–5621 (2016). https://doi.org/10.1007/s10854-016-4468-7

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  • DOI: https://doi.org/10.1007/s10854-016-4468-7

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