Shear strength of copper joints prepared by low temperature sintering of silver nanoparticles

Abstract

In this work, mechanical properties of Cu-to-Cu joint samples prepared by low temperature sintering of Ag nanoparticle paste have been investigated. The silver nanopaste was prepared by a controlled thermal decomposition of an organometallic precursor. The as-synthesized Ag particles were spherical, with an average diameter of 8.5 nm. The Cu-to-Cu joint samples were made by placing a small amount of Ag nanopaste between two polished Cu plates and sintering at 150°C, 200°C, 220°C and 350°C in air. A normal load was applied to aid sintering. Mechanical properties were measured by imposing a uniform stress across the sample bond area and measuring the corresponding strain. The application of external load was found to have a positive effect on the material’s mechanical properties. Furthermore, interestingly high values of shear strength were observed.