Abstract
The curing reaction and reaction mechanism of epoxy resin E-44, for which aromatic amine modified dicyandiamide was used as a curing reagent, were investigated by means of differential scanning calorimetry (DSC). The results showed that the modified dicyandiamide had better curing characteristic than unmodified dicyandiamide for epoxy resin E-44, and the curing reaction could be carried out at moderate temperature. Apparent activation energy of the curing reaction was decreased appreciably from 123.829 kJ/mol to 61.550-64.405 kJ/mol, and reaction order was decreased from 0.941 to 0.896–0.900. Curing reaction mechanism also was discussed.
Similar content being viewed by others
References
Guthner T, Hammer E. Curing of Epoxy Resins with Dicyandiamide and Urones[J]. Journal of Applied Polymer Science, 1993, 50: 1453–1459.
Jiao Jian, Lan Liwen. Study on Effect of Metal-Complex Accelerant to Dicyandiamide Curing Epoxy Resin[J]. Material Engineering, 1999, 10: 27–30(Ch).
Zhang Yang, Liang Shumin. Synthesis of M-Cd a Latent Curing Accelerator for Epoxy Resins and Its Use[J]. Chemistry and Adhesion, 2002, 3: 109–111(Ch).
Jiao Jian, Lan Liwen. Study on Curing Reaction of Epoxy Resin Using Modified Dicyandiamide[J]. Northwest University of Technology, 1999, 17(4): 619–623(Ch).
Ghaemy M, Sadjady S. Kinetic Analysis of Curing Behavior of Diglycidy Ether of Bisphenol A with Imidazoles Using Differential Scanning Calorimetry Techniques[J]. Journal of Applied Polymer Science, 2006, 100: 2634–2641.
Subramari S, Nasar A S, Gnanarajan T P, et al. Structure-Property Relationship of Blocked Diisocyanates: Synthesis of Polyimides Using Imidazole-Blocked Isocyanates[J]. Polym Int, 2000, 49: 546–550.
Barton J M, Hamerton I, Howlin B J, et al. Studies of Temperature and Time-Dependent Network Formation in Commercial Epoxy Resin Using Modified Imidazole Curing Agents[J]. Polym Int, 1996, 41: 159–168.
Cao Ming, Xie Ping, Jin Zhong, et al. Novel Microencapsulated Curing Accelerator for Prolinging Shelf of Epoxy Resin Composition[J]. Journal of Applied Polymer Science, 2002, 85: 873–878(Ch).
Chen Lianxi, Zhang Huiling, Liu Quanwen. Syntheses of Curing Agent Modefied Dicyandiamide by m-Toluidine[J]. Journal of Wuhan University of Technology, 2005, 27(8): 11–13(Ch).
Chen Lianxi, Zhang Huiling. Syntheses and Properties of Curing Agent Modified Dicyanodiamide by p-Toluidime [J]. Adhesion in China, 2004, 25(4): 17–19(Ch).
Kissinger H E. Variation of Peak Temperature with Heating Rate in Differential Thermal Analysis[J]. J Res Nat Stand, 1956, 57: 217.
Crane L W, Dynes P J, Kaelble D H. Analysis of Curing Kinetics in Polymer Composites[J]. J Polym Sci Polym Lett, 1973, 11: 533–538.
Author information
Authors and Affiliations
Corresponding author
Additional information
Foundation item: Supported by the National High Technology Research and Development Program of China (863 Program) (2003AA305920)
Biography: CHEN Lianxi(1964–), male, Associate professor, research direction: fine chemicals, organic and polymeric materials.
Rights and permissions
About this article
Cite this article
Chen, L., Tian, H., Liu, Q. et al. Curing reaction kinetics of epoxy resin using dicyandiamide modified by aromatic amines. Wuhan Univ. J. of Nat. Sci. 12, 1105–1108 (2007). https://doi.org/10.1007/s11859-007-0104-y
Received:
Issue Date:
DOI: https://doi.org/10.1007/s11859-007-0104-y