Abstract
Isothermal and dynamic differential scanning calorimetry (DSC) was exploited to study the curing behavior of diglycidyl ether bisphenol-A epoxy resin with various combining ratios of dicyandiamide (DICY) and nadic methyl anhydride (NMA). Curves of prepared samples indicated that the enthalpy of the reaction decreased with increasing the molar ratios (NMA/DICY) up to 40% after which an exothermic peak peculiar to the effect of anhydride appeared at a higher temperature. The curing behavior examination of the samples containing the aforementioned molar ratio of NMA/DICY (= 40%) was carried out using isothermal condition at different temperatures (130–145 °C) and dynamic condition DSC at various heating rates (2.5–20 °C min−1). Under the isothermal condition, by constructing a master curve, the values of activation energy (Ea) and pre-exponential factor (A) were calculated 89.3 kJ mol−1 and 1.2 × 10+9 s−1, respectively. The activation energy of the curing reactions in a dynamic mode was obtained 85.32 kJ mol−1 and 88.02 kJ mol−1 using Kissinger and Ozawa methods, respectively. Likewise, pre-exponential factors were also calculated 3.35 × 10+8 and 7.4 × 10 +8 s−1, respectively. The overall order of reaction for both conditions was found to be a value around 3.
Similar content being viewed by others
References
Monteserín C, Blanco M, Laza JM, Aranzabe E, Vilas JL. Thickness effect on the generation of temperature and curing degree gradients in epoxy–amine thermoset systems. J Therm Anal Calorim. 2018;132(3):1867–81.
Morancho J, Fernández-Francos X, Acebo C, Ramis X, Salla J, Serra Àjjo TA, et al. Thermal curing of an epoxy-anhydride system modified with hyperbranched poly (ethylene imine) s with different terminal groups. J Therm Anal Calorim. 2017;127(1):645–54.
Flick EW. Epoxy resins, curing agents, compounds, and modifiers: an industrial guide. 2nd ed. William Andrew/Noyes: Park Ridge; 1993.
Hamed AA, Saad GR, Elsabee MZ. Synthesis and characterization of modified epoxy resins and novel E-glass-/spectra-reinforced composites. High Perform Polym. 2017;29(3):328–40.
Jaipuriar A, Bakis CE, Lopez MM, editors. Cure kinetics and physical aging of an ambient-curing epoxy resin. In: Proceedings of the 6th international conference on CICE; 2012; 6(13).
Pascault JP, Williams RJ. Epoxy polymers. Germany: Wiley; 2009.
Yousefi A, Lafleur P, Gauvin R. Kinetic studies of thermoset cure reactions: a review. Polym Compos. 1997;18(2):157–68.
Cai H, Li P, Sui G, Yu Y, Li G, Yang X, et al. Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC. Thermochim Acta. 2008;473(1):101–5.
Wan J, Li C, Bu Z-Y, Xu C-J, Li B-G, Fan H. A comparative study of epoxy resin cured with a linear diamine and a branched polyamine. Chem Eng J. 2012;188:160–72.
Chandran MS, Krishna M, Rai S, Krupashankara M, Salini K. Cure kinetics and activation energy studies of modified bismaleimide resins. ISRN Polym Sci. 2012;2012:1–8.
Hayaty M, Beheshty MH, Esfandeh M. Isothermal differential scanning calorimetry study of a glass/epoxy prepreg. Polym Adv Technol. 2011;22(6):1001–6.
Pagano RL, Calado VM, Tavares FW, Biscaia EC. Cure kinetic parameter estimation of thermosetting resins with isothermal data by using particle swarm optimization. Eur Polym J. 2008;44(8):2678–86.
Kim SW, Nam J-D. Study of cure kinetic modeling of RSL-1895 epoxy system using composite kinetic methodology. J Ind Eng Chem. 2002;8:212.
Sacher E. Kinetics of epoxy cure: 3. the systems bisphenol-A epoxides/dicy. Polymer. 1973;14(3):91–5.
LaLiberte BR, Bornstein J, Sacher RE. Cure behavior of an epoxy resin-dicyandiamide system accelerated by monuron. Ind Eng Chem Prod Res Dev. 1983;22(2):261–2.
Schneider N, Sprouse J, Hagnauer G, Gillham J. DSC and TBA studies of the curing behavior of two dicy-containing epoxy resins. Polym Eng Sci. 1979;19(4):304–12.
Ren R, Xiong X, Ma X, Liu S, Wang J, Chen P, et al. Isothermal curing kinetics and mechanism of DGEBA epoxy resin with phthalide-containing aromatic diamine. Thermochim Acta. 2016;623:15–21.
Hong S-G, Wu C-S. DSC and FTIR analysis of the curing behaviors of epoxy/DICY/solvent open systems. Thermochim Acta. 1998;316(2):167–75.
Güthner T, Hammer B. Curing of epoxy resins with dicyandiamide and urones. J Appl Polym Sci. 1993;50(8):1453–9.
Romão B, Diniz MF, Azevedo MF, Lourenço VL, Pardini LC, Dutra RC, et al. Characterization of the curing agents used in epoxy resins with TG/FT-IR technique. Polimeros. 2006;16(2):94–8.
Zee R, Huang Y, Chen J, Jang B. Properties and processing characteristics of dielectric-filled epoxy resins. Polym Compos. 1989;10(4):205–14.
Tadros R, Timm D. Fourier-transform infrared analysis of a linear, anhydride-cured epoxy. Macromolecules. 1995;28(22):7441–6.
Rocks J, George GA, Vohwinkel F. Curing kinetics and thermomechanical behaviour of co-anhydride cured aminoglycidyl epoxy resins. Polym Int. 2003;52(11):1758–66.
Hu J, Shan J, Zhao J, Tong ZJ. Water resistance and curing kinetics of epoxy resins with a novel curing agent of biphenyl-containing amine synthesized by one-pot method. Thermochim Acta. 2015;606:58–65.
Jain R, Choudhary V, Narula A. Studies on the curing kinetics of epoxy resins using mixture of nadic/or maleic anhydride and 4, 4′-diaminodiphenyl sulfone. J Therm Anal Calorim. 2007;90(2):495–501.
Jain R, Choudhary V, Narula A. Curing and thermal behavior of DGEBA in presence of dianhydrides and aromatic diamine. J Appl Polym Sci. 2007;105(6):3804–8.
Chian W, Timm DC. Chemical/mechanical analyses of anhydride-cured thermosetting epoxys: DGEBA/NMA/BDMA. Macromolecules. 2004;37(21):8098–109.
Stockel RF. Dicyandiamide (cyanoguanidine). J Chem Educ. 1969;46(6):391.
Vafayan M, Beheshty MH, Ghoreishy MHR, Abedini H. Advanced integral isoconversional analysis for evaluating and predicting the kinetic parameters of the curing reaction of epoxy prepreg. Thermochim Acta. 2013;557:37–43.
Fan M, Li X, Zhang J, Cheng J. Curing kinetics and shape-memory behavior of an intrinsically toughened epoxy resin system. J Therm Anal Calorim. 2015;119(1):537–46.
Jovičić M, Radičević R, Pavličević J, Bera O. Isoconversional kinetic analysis of the alkyd/melamine resins curing. Chem Ind Chem Eng Q. 2013;19(2):253–62.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Gerami, G., Bagheri, R. & Darvishi, R. Investigation of isothermal and dynamic cure kinetics of epoxy resin/nadic methyl anhydride/dicyandiamide by differential scanning calorimetry (DSC). J Therm Anal Calorim 137, 575–582 (2019). https://doi.org/10.1007/s10973-018-7961-9
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10973-018-7961-9