Abstract
This study investigated a new adhesive system, consisting of soy protein isolate (SPI) and Kymene® 557H (simply called Kymene) (a commercial wet-strength agent for paper), that was prepared by mixing SPI and Kymene. Wood composites bonded with SPI-Kymene adhesive preparations had shear strengths comparable to or higher than those bonded with commercial phenol formaldehyde resins. Wood composites bonded with the new adhesive system had high water resistance and retained relatively high strength even after they had undergone a boiling-water test. The new adhesive system is formaldehyde-free, easy to use, and environmentally friendly. Kymene was proposed to serve as a curing agent in SPI-Kymene adhesives.
Similar content being viewed by others
References
Wolf, W.J., and J.C. Cowan, Soybeans as a Food Source, CRC, Cleveland, OH, 1975.
Wolf, W.J., Soybean Proteins: Their Functional, Chemical, and Physical Properties, J. Agric. Food Chem. 18:969–976 (1970).
Johnson, R.S., An Overview of North American Wood Adhesive Resins, in Wood Adhesives 2000, Forest Products Society, Madison, WI, 2000, pp. 41–49.
Meyer, B., and K. Hermans, Formaldehyde Release from Wood Products: An Overview, in Formaldehyde Release from Wood Products, edited by B. Meyer, B.A.K. Andrews, and R.M. Reinhardt, American Chemical Society, Washington DC, 1986, pp. 1–16.
Marutzky, R., Release of Formaldehyde by Wood Products, in Wood Adhesives—Chemistry and Technology, edited by A. Pizzi, Marcel Dekker, New York, 1989, pp. 307–387.
Henderson, J.T., Volatile Emissions from the Curing of Phenolic Resins, TAPPI J. 62:9396 (1979).
Baumann, M.G.D., L.F. Lorenz, S.A. Batterman, and G.-Z. Zhang, Aldehyde Emission from Particleboard and Medium Density Fiberboard Products, Forest Prod. J. 50:75–82 (2000).
Swenberg, J.A., W.D. Kerns, R.I. Mitchell, E.J. Gralla, and K.L. Pavkov, Induction of Squamous Cell Carcinomas of the Rat Nasal Cavity by Inhalation Exposure to Formaldehyde Vapor, Cancer Res. 40:3398–3402 (1980).
Perera, F., and C. Petito, Formaldehyde: A Question of Cancer Policy? Science 216:1285–1291 (1982).
Heck, H.D., M. Casanova, and T.B. Starr, Formaldehyde Toxicity-New Understanding, Crit. Rev. Toxicol. 20:397–426 (1990).
Lambuth, A.L., Adhesives from Renewable Sources: Historical Perspective and Wood Industry Needs, in Adhesives from Renewable Sources, edited by R.W. Hemingway, A.H. Conner, and S.J. Branham, American Chemical Society, Washington DC, 1989, ACS Symposium Series 385, pp. 5–6.
Liu, K., Soybeans-Chemistry, Technology, and Utilization, Kluwer Academic, New York, 1997.
Lorenz, L.F., A.H. Conner, and A.W. Christiansen, The Effect of Soy Protein Additions on the Reactivity and Formaldehyde Emissions of Urea-Formaldehyde Adhesive Resins, Forest Prod. J. 49:73–78 (1999).
Kuo, M., D. Adams, D. Myers, D. Curry, H. Heemstra, J.L. Smith, and Y. Bian, Properties of Wood/Agricultural Fiberboard Bonded with Soybean-Based Adhesives, 48:71–75 (1998).
Hettiarachchy, N.S., and U. Kalapathy, Functional Properties of Soy Proteins, in Functional Properties of Proteins and Lipids, edited by J.R. Whitaker, American Chemical Society, Washington, DC, 1998, pp. 80–95.
Hettiarachchy, N.S., U. Kalapathy, and D.J. Myers, Alkali-Modified Soy Protein with Improved Adhesive and Hydrophobic Properties, J. Am. Oil Chem. Soc. 72:1461–1464 (1995).
Huang, W., and X. Sun, Adhesive Properties of Soy Proteins Modified by Sodium Dodecyl Sulfate and Sodium Dodecylbenzene Sulfonate, 77:705–708 (2000).
Huang, W., and X. Sun, Adhesive Properties of Soy Proteins Modified by Urea and Guanidine Hydrochloride, 77:101–104 (2000).
Sun, X., and K. Bian, Shear Strength and Water Resistance of Modified Soy Protein Adhesives, 76:977–980 (1999).
Keim, G.I., Cationic Thermosetting Polyamide-Epichlorohydrin Resins for Preparing Wet-Strength Paper, U.S. Patent 2,926,154 (1960).
Keim, G.I., High Wet-Strength Paper, U.S. Patent 2,929,116 (1960).
Espy, H.H., The Mechanism of Wet-Strength Development in Paper: A Review, TAPPI J. 78:90–99 (1995).
Espy, H.H., and T.W. Rave, The Mechanism of Wet-Strength Development by Alkaline-Curing Amino Polymer-Epichlorohydrin Resins, 71:133–137 (1988).
Dunlop-Jones, N., Wet Strength Chemistry, in Paper Chemistry, edited by J.C. Roberts, Blackie Academic & Professional, New York, 1996, pp. 98–119.
Moyer, W.W., and R.A. Stagg, Polyamide-Polyamine-Epichlorohydrin Resins, in Wet Strength in Paper and Paperboard, TAPPI Press, Atlanta, 1965, pp. 33–37.
Chan, L.L., Epoxidized Polyamide Resins, TAPPI Wet and Dry Strength Short Course, TAPPI Press, Atlanta, 1988, pp. 25–30.
Espy, H.H., Alkaline-Curing Polymeric Amine-Epichlorohydrin Resins, in Wet-Strength Resins and Their Application, edited by L.L. Chan, TAPPI Press, Atlanta, 1994, pp. 13–44.
Bates, N.A., Polyamide-Epichlorohydrin Wet-Strength Resin II. A Study of the Mechanism of Wet-Strength Development in Paper, TAPPI J. 52:1162–1168 (1969).
Linhart, F., The Practical Application of Wet-Strength Resins, in Applications of Wet-End Paper Chemistry, edited by C.O. Au and I. Thorn, Blackie Academic & Professional, New York, 1995, pp. 102–119.
Author information
Authors and Affiliations
Corresponding author
About this article
Cite this article
Li, K., Peshkova, S. & Geng, X. Investigation of soy protein-kymene® adhesive systems for wood composites. J Amer Oil Chem Soc 81, 487–491 (2004). https://doi.org/10.1007/s11746-004-0928-1
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11746-004-0928-1