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Investigation of the Microstructure and the Mechanical Properties of Cu-NiC Composite Produced by Accumulative Roll Bonding and Coating Processes

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Abstract

In the present study, Cu-1.8 wt.% NiC (nickel coating) composite was produced by the combination of two methods, including accumulative roll bonding (ARB) and electroplating processes. Electroplating process was done on copper strips in order to produce a nickel-particle-reinforced composite. Microstructure, texture, and the mechanical properties of the produced composite were evaluated during various cycles of ARB using optical and scanning electron microscopes, x-ray diffraction, microhardness, and tensile tests. In addition, the results were compared with Cu-Cu and also Cu-NiS (nickel sheet) samples. It was found that nickel layers were fractured from the first cycle of the process, and nickel fragments were distributed in the copper matrix as the number of cycles was increased. Variation of orientation density of α-, β-, and τ-fibers for the produced composite was examined in different cycles. Microhardness for different elements in different cycles of Cu-NiC was also evaluated. Also, the investigation of the mechanical properties showed that by proceeding the ARB process, the tensile strength of the produced Cu-NiC and Cu-Cu samples was increased. However, improvement in the mechanical properties of composite samples was more noticeable due to the reinforcing effect of nickel particles. The elongation of composite samples showed a decrease in the primary cycles, unlike Cu-Cu ones; however, it was then increased. Finally, by using scanning electron microscopy, the fracture surfaces of Cu-NiC composite were studied to disclose the fracture mechanism of the samples.

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Correspondence to Mohammad Reza Toroghinejad.

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Shabani, A., Toroghinejad, M.R. Investigation of the Microstructure and the Mechanical Properties of Cu-NiC Composite Produced by Accumulative Roll Bonding and Coating Processes. J. of Materi Eng and Perform 24, 4746–4754 (2015). https://doi.org/10.1007/s11665-015-1795-4

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  • DOI: https://doi.org/10.1007/s11665-015-1795-4

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