Abstract
Mössbauer spectroscopy was used to characterize dispersion-strengthened composite solder powders that were formed through hot gas spray atomization. To perform quantitative measurements, we first measured the relative recoilless fractions of eutectic solder and three intermetallic compounds: Cu3Sn, Cu6Sn5, and Ni3Sn4. These results were then used to determine the concentrations of intermetallic species present in various composite solder samples. Mössbauer spectroscopy was shown to be an effective tool in the analysis of dispersion-strengthened composite solders and was preferentially sensitive to the presence of tin-based intermetallics and oxides.
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References
S.M.L. Sastry, D.R. Frear, G. Kuo and K.L. Jerina, The Mechanics of Solder Alloy Wetting & Spreading, eds., Fredrick G. Yost, F. Michael Hosking and Darrel R. Frear, (New York: Van Nostrand Reinhold, 1993), p. 299.
R.L. Mössbauer, Z. Physik 151, 124 (1958).
N.N. Greenwood and T.C. Gibb, Mössbauer Spectroscopy, (London: Chapman & Hall, 1971).
Richard L. Cohen, Applications of Mössbauer Spectroscopy, Vol. I (New York: Academic Press, 1976).
Mössbauer Spectroscopy, ed. U. Gonser, (New York: Springer- Verlag, 1975).
C. Hohenemser, Phys. Rev. 139, A185 (1965).
J. Silver, C.A. Mackay and J.D. Donaldson, J. Mater. Sci. 11, 836(1976).
J. Jaen, A. Vertes, K.M. Tjutina, L.V. Kasmodamiyanskaya, L. Kiss and E.V. Shepeleva, Electrochimica Acta 30, 535 (1985).
N.N. Delyagin and V.E. Nesterov, Sou. Phys. JETP. 64, 1367 (1986).
N. Arriola and T.E. Cranshaw, J.Phys. F:Met. Phys. 18,1621 (1988).
D.W. Hafemeister and E. Brooks Shera, Nucl. Iustrum. and Methods. 41, 133 (1966).
J.F. Roeder, M.R. Notis and H. J. Frost, Solder Mechanics-A State of the Art Assessment, eds., D.R. Frear, W.B. Jones, and K.R. Kinsman, (Warrendale, PA: TMS, 1991).
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Reno, R.C., Panunto, M.J. & Piekarski, B.H. A Mössbauer Study of Tin-Based Intermetallics Formed During the Manufacture of Dispersion-Strengthened Composite Solders. J. Electron. Mater. 26, 11–15 (1997). https://doi.org/10.1007/s11664-997-0125-5
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DOI: https://doi.org/10.1007/s11664-997-0125-5