Abstract
Previous chapters of this book have discussed the wetting behavior of near-eutectic Sn-Pb solders. These alloys are the most common in electronic applications and are deserving of the greatest attention. However, there are many applications where the properties of these alloys can be improved. A composite solder, or a solder that contains second-phase dispersions of particles, could improve solder joint properties. The area where composite solders could have the greatest impact is in improving the mechanical properties of the joint. However, the wetting behavior of the solder cannot be compromised for the sake of the mechanical properties -good wetting behavior is a necessity. Therefore, for a composite solder to be useful for electronic packaging applications mechanical properties, wetting and manufacturability must be optimized.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Ackroyd, M. L., and C. A. Thwaites. 1975. Metals Technol. pp. 73–85.
Argon, A. S., Editor. 1969. Physics of Strength and Plasticity. Cambridge, MA.: The MIT Press, p. 127.
Bangs, E. R., and R. E. Beal. 1975. Welding Res. Supp. Oct. 1975. p. 377s.
Betrabet, H. S., and S. M. McGee. 1992. Proc. NEPCON ′92. Anaheim, CA. pp. 1276–77.
Betrabet, H. S., S. M. McGee, and J. K. McKinlay. 1991a. Scripta Metall. 25:2323–28.
Betrabet, H. S., S. M. McGee, and J. K. McKinlay. 1991b. J. Mater. Sci. 27:4009–15.
Clough, R. B., et al. 1992. Proc. NEPCON ′92. Anaheim, CA. pp. 1256–65.
Courtney, T. H. 1990. Mechanical Behavior of Materials. New York: McGraw-Hill. p. 577.
Embury, J. D. 1985. Metall. Trans. 16A:2197.
Frear, D. R. 1989a. Proc. 39th IEEE Electron. Comp. Conf. 39:293.
Frear, D. R. 1989b. IEEE Comp. Hybrids and Manuf Technol. IEEE CHMT-12. p. 492.
Frear, D. R., D. Grivas, and J. W. Morris Jr. 1988. J. Electron. Mater. 17:171–80.
Frear, D. R., J. B. Posthill, and J. W. Morris Jr. 1989. Met. Trans. A. 17A:1325.
Frear, D. R., and W. B. Jones. 1990. Proc. NEPCON West ′90. Anaheim, CA. pp. 1324–52.
Frear, D. R., W. B. Jones, and K. R. Kinsman. 1991. Solder Mechanics: A State of the Art Assessment. Warrendale, PA.: TMS Publications, pp. 191–237.
Frear, D. R., W. B. Jones, and N. R. Sorenson. 1991. CREEP: Characterization, Damage and Life Assessment. D. A. Woodford, C. H. A. Townley, and M. Ohnami, Editors. ASM International, pp. 341–50.
Glazer, J., T. Kramer, and J. W. Morris Jr. 1991. J. Surf. Mount Technol. 4:15.
Grivas, D. 1978. Deformation of Superplastic Alloys at Relatively Low Strain Rates. Ph.D. Thesis. Berkeley: University of California.
Ho, C. T., and D. D. L. Chung. 1991. J Mater. Research.
IBM. 1986. IBM Technical Disclosure Bull. 29:1573.
Johnson, C. C., and J. Kevra. 1989. Solder Paste Technology: Principles and Applications. Blue Ridge Summit, PA.: TAB Professional and Reference Books, Inc.
Kashyap, B. P., and G. B. Murty. 1981. Mater. Sci. and Eng. 50:205–13.
Kelly, P. M. 1972. Scripta Metall. 6:647–56.
Kim, Y. -W., and W. M. Griffith. 1988. Dispersion Strengthened Aluminum Alloys. p. 181.
Knecht, S., and L. R. Fox. 1990. IEEE Trans. CHMT. 13(2):424–33.
Lee, S. N., and D. S. Stone. 1990. Proc. 40th IEEE ECTC. Las Vegas, NV. 40:491.
MacKay, C. A. 1981. IPC-TP-380. IPC Fall Mtg. Dallas, TX.
Mall, S. E., A. Mall, and T. Nicholas. 1990. J. Eng. Mater, and Technol. 112:435.
Marshall, J. L., J. Sees, and J. Calderon. 1992. Proc. NEPCON ′92. Anaheim, CA. pp. 1278–83.
Mei, Z., R. Hansen, M. C. Shine, and J. W. Morris Jr. 1990. Proc. ASME Annual Winter Mtg.
Mizuishi, K., M. Tokuda, and Y. Fujita. 1988. Proc. IEEE Comp. Hybrids Manuf. Technol. IEEE CHMT-38. pp. 330–34.
Mohamed, F. A., and T. G. Langdon. 1975. Phil. Mag. 32:697–709.
Nakamura, et al. 1986. Japanese Patent No. 61–16523.
Pinizzotto, R. F., et al. 1992. Proc. NEPCON ′92. Anaheim, CA. pp. 1284–98.
Pink, E., R. Kutschej, and H. P. Stuewe. 1976. Scripta Metall. 10:759–62.
Pink, E., R. Kutschej, and H. P. Stuewe. 1981. Scripta Metall. 15:185–89.
Sastry, S. M. L., et al. 1992. Proc. NEPCON ′92. Anaheim, CA. pp. 1266–75.
Schmidt-Thomas, K. G., and S. Wege. 1986. Brazing and Soldering. 11:27.
Shine, M. C, and L. R. Fox. 1988. ASTM STP 242. Amer. Soc. Testing and Mater. pp. 588.
Smithells, C. J. 1976. Metals Reference Book. 5th Ed.
Steen, H. A. H., and G. Becker. 1986. Brazing and Soldering. No. 11. pp. 4–11.
Tribula, D. 1990. A Microstructural Study of Creep and Thermal Fatigue Deformation in 60Sn-40Pb Solder Joints. Ph.D. Thesis. Berkeley: University of California.
Tribula, D., D. Grivas, D. R. Frear, and J. W. Morris Jr. 1989. ASME J. Electron. Pack. 111:83.
Tribula, D., and J. W. Morris Jr. 1990. ASME J. Electron. Pack. 112:94.
Wasynczuk, J. A., and G. K. Lucey. 1992. Proc. NEPCON ′92. Anaheim, CA. pp. 1245–55.
Weinbel, R. C., J. K. Tien, R. A. Pollack, and S. K. Kang. 1987. J. Mater. Sci. 22:3901–06.
Wild, R. N. 1972. Welding Res. Supp. 51:521s.
Wolverton, W. M. 1987. Brazing and Soldering. 12:33.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1993 Van Nostrand Reinhold
About this chapter
Cite this chapter
Sastry, S.M.L., Frear, D.R., Kuo, G., Jerina, K.L. (1993). The Properties of Composite Solders. In: Yost, F.G., Hosking, F.M., Frear, D.R. (eds) The Mechanics of Solder Alloy Wetting and Spreading. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-1440-0_10
Download citation
DOI: https://doi.org/10.1007/978-1-4684-1440-0_10
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4684-1442-4
Online ISBN: 978-1-4684-1440-0
eBook Packages: Springer Book Archive