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Effects of Fe and Bi Minor Alloying on Mechanical, Thermal, and Microstructural Properties of Sn-0.7Cu Solder Alloy

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Abstract

The effects of adding 0.05 wt.% Fe and 1 wt.% or 2 wt.% Bi on the mechanical, thermal, and microstructural properties of Sn-0.7Cu solder alloy have been investigated. Addition of 0.05% Fe did not change the morphology of the microstructure, so the mechanical properties and melting behavior remained unchanged. Analyses showed that, besides inclusion of Fe in Cu6Sn5 intermetallic compound (IMC), a few FeSn2 IMCs formed in interdendritic regions. On the other hand, addition of 2% Bi to Sn-0.7Cu-0.05Fe alloy increased the yield strength by 97%, from 19.7 MPa to 38.84 MPa. This is because addition of Bi degraded interdendritic regions by reducing the amount of Cu6Sn5 IMC particles and refining primary β-Sn dendrites. Furthermore, differential scanning calorimetry indicated that Bi reduced the melting temperature by 4°C from 232.2°C to 228.1°C for the 2% Bi alloy.

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Acknowledgements

The authors acknowledge financial support provided by the University of Malaya under PPP Fund Project No. PG079/2014A, UMRG Fund Project No. RP003A-13AET, and HIR Grant No. UM.C/625/1/HIR/MOHE/ENG/29.

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Authors and Affiliations

  1. Department of Mechanical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia

    M. H. Mahdavifard, M. F. M. Sabri, D. A. Shnawah, I. A. Badruddin & S. Rozali

  2. Department of Electrical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia

    S. M. Said

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  1. M. H. Mahdavifard
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  2. M. F. M. Sabri
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  3. S. M. Said
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  4. D. A. Shnawah
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  5. I. A. Badruddin
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  6. S. Rozali
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Correspondence to M. F. M. Sabri.

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Mahdavifard, M.H., Sabri, M.F.M., Said, S.M. et al. Effects of Fe and Bi Minor Alloying on Mechanical, Thermal, and Microstructural Properties of Sn-0.7Cu Solder Alloy. J. Electron. Mater. 45, 3673–3682 (2016). https://doi.org/10.1007/s11664-016-4521-6

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  • DOI: https://doi.org/10.1007/s11664-016-4521-6

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