Skip to main content
SpringerLink
Log in

Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

Sn-0.7Cu-xNi composite solder has been fabricated via mechanical mixing of different weight percentages of Ni particles with Sn-0.7Cu solder paste, and the effect of the Ni concentration on the microstructure, wettability, and tensile properties of Cu/Sn-0.7Cu-xNi/Cu solder joints investigated. The results show that refined dot-shaped particles of intermetallic compounds (IMCs) are uniformly dispersed in a primary β-Sn matrix in the Cu/Sn-0.7Cu-(0.05–0.1)Ni/Cu solder joints. The interfacial IMC layer thickness increased slightly when adding Ni content to 0.05 wt.%, then rapidly when further increasing the Ni concentration to 0.4 wt.%. Excellent wettability with bright appearance was obtained for the Sn-0.7Cu-0.05Ni solder due to diminished interfacial tension. The tensile properties improved after adding Ni content to 0.05 wt.% due to the presence of the refined dot-like IMC particles, in agreement with theoretical predictions based on the combination of dispersion and grain-refinement strengthening mechanisms. Refined microstructure and enhanced mechanical properties were obtained for the Cu/Sn-0.7Cu-0.05Ni/Cu solder joint.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. E. Lillie, P. Sandborn, and D. Humphrey, Microelectron. Reliab. 55, 969 (2015).

    Article  Google Scholar 

  2. A.A. El-Daly and A.M. El-Taher, Mater. Des. 51, 789 (2013).

    Article  Google Scholar 

  3. L. Yang, Y.C. Zhang, C.C. Du, J. Dai, and N. Zhang, Microelectron. Reliab. 55, 596 (2015).

    Article  Google Scholar 

  4. H. Nishikawa, J.Y. Piao, and T. Takemoto, J. Electron. Mater. 35, 1127 (2006).

    Article  Google Scholar 

  5. Y. Tang, G.Y. Li, S.M. Luo, K.Q. Wang, and B. Zhou, J. Electron. Mater. 44, 2440 (2015).

    Article  Google Scholar 

  6. L.C. Tsao, S.Y. Chang, C.I. Lee, W.H. Sun, and C.H. Huang, Mater. Des. 31, 4831 (2010).

    Article  Google Scholar 

  7. Y. Tang, G.Y. Li, D.Q. Chen, and Y.C. Pan, J. Mater. Sci. Mater. Electron. 25, 981 (2014).

    Article  Google Scholar 

  8. P. Xue, S.B. Xue, Y.F. Shen, F. Long, and H. Zhu, J. Mater. Sci. Mater. Electron. 25, 3520 (2014).

    Article  Google Scholar 

  9. A.K. Gain, Y.C. Chan, and W.K.C. Yung, Mater. Sci. Eng. B 162, 92 (2009).

    Article  Google Scholar 

  10. X.D. Liu, Y.D. Han, H.Y. Jing, J. Wei, and L.Y. Xu, Mater. Sci. Eng. A 562, 25 (2013).

    Article  Google Scholar 

  11. H.X. Xie, D. Friedman, K. Mirpuri, and N. Chawla, J. Electron. Mater. 43, 33 (2014).

    Article  Google Scholar 

  12. X. Chen, J. Zhou, F. Xue, J. Bai, and Y. Yao, J. Electron. Mater. 44, 725 (2015).

    Article  Google Scholar 

  13. P. Xue, S.B. Xue, Y.F. Shen, and H. Zhu, J. Mater. Sci. Mater. Electron. 25, 2671 (2014).

    Article  Google Scholar 

  14. Y.L. Tseng, Y.C. Chang, and C.C. Chen, J. Electron. Mater. 44, 581 (2015).

    Article  Google Scholar 

  15. J. Shen, Y.Y. Pu, H.G. Yin, and Q. Tang, J. Electron. Mater. 44, 532 (2015).

    Article  Google Scholar 

  16. F. Guo, J. Lee, S. Choi, J.P. Lucas, T.R. Bieler, and K.N. Subramanian, J. Electron. Mater. 30, 1073 (2001).

    Article  Google Scholar 

  17. F. Guo, J. Lee, J.P. Lucas, K.N. Subramanian, and T.R. Bieler, J. Electron. Mater. 30, 1222 (2001).

    Article  Google Scholar 

  18. B.L. Silva, N. Cheung, A. Garcia, and J.E. Spinelli, J. Alloys Compd. 632, 274 (2015).

    Article  Google Scholar 

  19. W.X. Dong, Y.W. Shi, Y.P. Lei, Z.D. Xia, and F. Guo, J. Mater. Sci. Mater. Electron. 20, 1008 (2009).

    Article  Google Scholar 

  20. A.E. Hammad, Mater. Des. 50, 108 (2013).

    Article  Google Scholar 

  21. A.A. El-Daly, A.E. Hammad, G.A. Al-Ganainy, and A.A. Ibrahiem, Mater. Des. 52, 966 (2013).

    Article  Google Scholar 

  22. S. Yagi, T. Ichitsubo, E. Matsubara, M. Yamaguchi, H. Kimura, and K. Sasamori, J. Alloys Compd. 484, 185 (2009).

    Article  Google Scholar 

  23. M.M. Billah, K.M. Shorowordi, and A. Sharif, J. Alloys Compd. 585, 32 (2014).

    Article  Google Scholar 

  24. T. Fouzder, Q.Q. Li, Y.C. Chan, and D.K. Chan, J. Mater. Sci. Mater. Electron. 25, 2529 (2014).

    Article  Google Scholar 

  25. J. Shen, Y.Y. Pu, D. Wu, Q. Tang, and M.L. Zhao, J. Mater. Sci. Mater. Electron. 26, 1572 (2015).

    Article  Google Scholar 

  26. C.H. Lin, S.W. Chen, and C.H. Wang, J. Electron. Mater. 31, 907 (2002).

    Article  Google Scholar 

  27. A.A. El-daly, A. Fawzy, S.F. Mansour, and M.J. Younis, Mater. Sci. Eng. A 578, 62 (2013).

    Article  Google Scholar 

Download references

Acknowledgements

This research was financially supported by the National Natural Science Foundation of China (Grant No. 51401037), Science and Technology Program of Jiangsu Province of China (Grant No. BK20141228), Science and Technology Program of Suzhou (Grant Nos. SYG201421, SYG201348, and SYG201251), Natural Science Foundation of the Jiangsu Higher Education Institutions of China (Grant Nos. 14KJB430001 and 13KJB430001), Scientific Research Project of Changshu Institute of Technology (JXK2014003), and Jiangsu Key Laboratory of Large Engineering Equipment Detection and Control (Grant No. JSKLEDC201301).

Author information

Authors and Affiliations

  1. School of Mechanical Engineering, Changshu Institute of Technology, Jiangsu, 215500, People’s Republic of China

    Li Yang, Jinguo Ge, Yaocheng Zhang, Jun Dai, Haixiang Liu & Jicen Xiang

  2. School of Materials Science and Engineering, China University of Mining and Technology, Jiangsu, 221008, People’s Republic of China

    Li Yang & Jinguo Ge

Authors
  1. Li Yang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jinguo Ge
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Yaocheng Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Jun Dai
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Haixiang Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Jicen Xiang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jinguo Ge.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Yang, L., Ge, J., Zhang, Y. et al. Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints. J. Electron. Mater. 45, 3766–3775 (2016). https://doi.org/10.1007/s11664-016-4509-2

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-016-4509-2

Keywords

Search

Navigation