Abstract
The microstructure and growth behaviors of interfacial intermetallic compounds (IMCs) between the Sn–0.7Cu–xNi (x = 0, 0.1, 0.25, 0.5, and 1.0 mass%) solder alloys and copper pad were explored to reveal the influence of the Ni addition into the Sn–0.7Cu based solder on the formation of interfacial IMCs and shear strength of the solder joints in the present study. The impacts of adding different Ni on the growth behavior and total thickness of Cu6Sn5/(Cu, Ni)6Sn5 and Cu3Sn IMCs layers were compared and discussed after reflowing at 533 K for 600 s and aging at 423 K for various aging durations. The thickness of interfacial IMC layers increased drastically with addition of small amount of Ni into the Sn0.7Cu solder alloy, however, the particle sizes of the IMC grains obviously decreased with the addition of Ni into the solder, compared to the Sn0.7Cu/Cu system. The results indicated that, Cu6Sn5 turned into (Cu, Ni)6Sn5 due to the addition of Ni element and would enhance the growth rate of interfacial IMC resulted from more Ni added. It is quite obvious that 1 wt% Ni addition to the Sn–0.7Cu solder alloy extremely enhance growth and formation of the IMC in Sn–0.7Cu–xNi/Cu joints. In addition, the single-lap shear tests were also carried out to evaluate the mechanical properties of the as-reflowed Sn0.7Cu–xNi/Cu solder joints. The results of shear tests indicated that the shear stress of Sn–0.7Cu–xNi/Cu solder joints gradually increased with the increase of Ni concentration, and the maximum shear strength was reached with 1 wt% Ni addition. Besides, doping Ni element into the Sn–0.7Cu solder changed the shear fractures morphology of Sn–0.7Cu/Cu joints, which were revealed to be ductile essentially with the moderate strain rate (3.33 × 10−3 s−1) and mainly occurred in the solder matrix rather than through the IMCs layer.
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References
S.C. Yang, C.C. Chang, M.H. Tsai, C.R. Kao, Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni. J. Alloys Compd. 499, 149–153 (2010)
K. Zeng, K.N. Tu, Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. 38, 55–105 (2002)
Y.W. Wang, Y.W. Lin, C.R. Kao, Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders. J. Alloys Compd. 493, 233–239 (2010)
X.W. Hu, W.J. Chen, B. Wu, Microstructure and tensile properties of Sn-1Cu lead-free solder alloy produced by directional solidification. Mater. Sci. Eng. A 556, 816–823 (2012)
H. Kang, M. Lee, D. Sun, S. Pae, J. Park, Formation of octahedral corrosion products in Sn-Ag flip chip solder bump. Scripta Mater. 108, 126–129 (2015)
H. Nishikawa, N. Iwata, Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag Cu solder on a Cu Pad. J. Mater. Process. Technol. 215, 6–11 (2015)
E.A. Eid, A.N. Fouda, E.S.M. Duraia, Effect of adding 0.5 wt% ZnO nanoparticles, temperature and strain rate on tensile properties of Sn-5.0 wt% Sb-0.5 wt% Cu (SSC505) lead free solder alloy. Mater. Sci. Eng. A 657, 104–114 (2016)
S.H. Kim, D.Y. Yang, Y.J. Kim, T. Min et al., Thermo-mechanical evolution of ternary Bi-Sn-In solder micropowders and nanoparticles reflowed on a flexible PET substrate. Appl. Surf. Sci. 415, 28–34 (2017)
M.Y. Tsai, S.C. Yang, Y.W. Wang, C.R. Kao, Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn–Zn systems. J. Alloys Compd. 494, 123–127 (2010)
T.L. Yang, J.Y. Wu, C.C. Li, S. Yang, C.R. Kao, Low temperature bonding for high temperature applications by using SnBi solders. J. Alloys Compd. 647, 681–685 (2015)
X.W. Hu, Y.L. Li, Y. Liu, Z.X. Min, Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification. J. Alloys Compd. 625, 241–250 (2015)
W.Y. Chen, T.C. Chiu, K.L. Lin, Y.S. Lai, Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint. Intermetallics 26, 40–43 (2012)
H.Q. Wang, F.J. Wang, F. Gao, X. Ma, Y.Y. Qian, Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. J. Alloys Compd. 433, 302–305 (2007)
X.W. Hu, K. Li, Z.X. Min, Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification. J. Alloys Compd. 566, 239–245 (2013)
T. Ventura, S. Terzi, M. Rappaz, A.K. Dahle, Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys. Acta Mater. 59, 1651–1658 (2011)
L.K. Zang, Z.F. Yuan, H.X. Zhao, X.R. Zhang, Wettability of molten Sn-Bi-Cu solder on Cu substrate. Mater. Lett. 63, 2067–2069 (2009)
S.W. Chen, C.H. Wang, Interfacial reactions of Sn–Cu/Ni at 250 °C. J. Mater. Res. 21, 2270–2277 (2006)
J.W. Xian, S.A. Belyakov, T.B. Britton, C.M. Gourlay, Heterogeneous nucleation of Cu6Sn5 in Sn-Cu-Al solders. J. Alloys Compd. 619, 345–355 (2015)
M. Slupska, P. Ozga, Electrodeposition of Sn-Zn-Cu alloys from citrate solutions. Electrochim. Acta 141, 149–160 (2014)
K.E. Yazzie, H.X. Xie, J.J. .Williams, N. Chawla, On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints. Scripta Mater. 66, 586–589 (2012)
P. He, X. Yue, J.H. Zhang, Hot pressing diffusion bonding of a titanium alloy to a stainless steel with an aluminum alloy interlayer. Mater. Sci. Eng. A 486, 171–176 (2008)
W.M. Chen, S.K. Kang, C.R. Kao, Effects of Ti addition to Sn-Ag and Sn-Cu solders. J. Alloys Compd. 520, 244–249 (2012)
P. He, D. Liu, Mechanism of forming interfacial intermetallic compounds at interface for solid state diffusion bonding of dissimilar materials. Mater. Sci. Eng. A 437, 430–435 (2006)
Z.X. Zhu, C.C. Li, L.L. Liao, C.K. Liu, C.R. Kao, Au-Sn bonding material for the assembly of power integrated circuit module. J. Alloys Compd. 671, 340–345 (2016)
Y.W. Wang, Y.W. Lin, C.T. Tu, C.R. Kao, Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu. J. Alloys Compd. 478, 121–127 (2009)
X. Hu, Y. Li, Z. Min, Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging. J. Alloys Compd. 582, 341–347 (2014)
P. He, J.H. Zhang, R.L. Zhou, X.Q. Li, Diffusion bonding technology of a titanium alloy to a stainless steel web with Ni interlayer. Mater. Charact. 43, 289–292 (1999)
H.Y. Chuang, J.J. Yu, M.S. Kuo, H.M. Tong, C.R. Kao, Elimination of voids in reactions between Ni and Sn: a novel effect of silver. Scripta Mater. 66, 171–174 (2012)
C.C. Li, J.H. Ke, C.A. Yang, C.R. Kao, Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn. Mater. Lett. 156, 150–152 (2015)
C.H. Wang, H.T. Shen, Effects of Ni addition on the interfacial reactions between Sn-Cu solders and Ni substrate. Intermetallics 18, 616–622 (2010)
C.M. Chuang, K.L. Lin, Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate. J. Electron. Mater. 32, 1426–1431 (2003)
G. Zeng, S.D. McDonald, Q.F. Gu, Y. Terada, K. Uesugi, H. Yasuda, K. Nogita, The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints. Acta Mater. 83, 357–371 (2015)
H.K. Cheng, C.W. Huang, H. Lee, Y.L. Wang, T.F. Liu, C.M. Chen, Interfacial reactions between Cu and SnAgCu solder doped with minor Ni. J. Alloys Compd. 622, 529–534 (2015)
W.T. Chen, C.E. Ho, C.R. Kao, Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders. J. Mater. Res. 17, 263–266 (2002)
T. Maeshima, H. Ikehata, K. Terui, Y. Sakamoto, Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder. Mater. Des. 103, 106–113 (2016)
H. Nishikawa, J.Y. Piao, T. Takemoto, Interfacial reaction between Sn-0.7Cu(-Ni) Solder and Cu substrate. J. Electron. Mater. 35, 1127–1132 (2006)
X.W. Hu, T. Xu, L.M. Keer, Y. Li, X. Jiang, Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates. J. Alloys Compd. 690, 720–729 (2017)
C.R. Yang, F.B. Song, S.W. Ricky Lee, Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints. Microelectron. Reliab. 54, 435–446 (2014)
F. Gao, T. Takemoto, H. Nishikawa, Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing. Mater. Sci. Eng. A 20, 39–46 (2006)
D.Y. C.Yu, J.S. Wang, J.J. Chen, J.M. Xu, H. Chen, Lu Study of Cu6Sn5 and Cu3Sn growth behaviors by considering trace Zn. Mater. Lett. 121, 166–169 (2014)
J.Y. Kim, J. Yu, S.H. Kim, Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints. Acta Mater. 57, 5001–5012 (2009)
P. Borgesen, L. Yin, P. Kondos, Acceleration of the growth of Cu3Sn voids in solder joints. Microelectron. Reliab. 52, 1121–1127 (2012)
Y.W. Wang, Y.W. Lin, C.R. Kao, Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates. Microelectron. Reliab. 49, 248–252 (2009)
K.J. Zeng, R. Stierman, T.C. Chiu, D. Edwards, Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability. J. Appl. Phys. 97, 024508 (2005)
W. Chen, S. Xue, H. Wang, J. Wang, Z. Han, Investigation on properties of Ga to Sn-9Zn lead-free solder. J. Mater. Sci.: Mater. Electron. 21, 496–502 (2010)
Acknowledgements
This work was supported by the Nature Science Foundation of China (No. 51465039, 51665038, 51765040), Nature Science Foundation of Jiangxi Province (20161BAB206122) and Key project of the Natural Science Foundation of Jiangxi Province (20171ACB21011).
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Lai, Y., Hu, X., Li, Y. et al. Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder joints. J Mater Sci: Mater Electron 29, 11314–11324 (2018). https://doi.org/10.1007/s10854-018-9219-5
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DOI: https://doi.org/10.1007/s10854-018-9219-5