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Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders

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Abstract

The influences of minor alloying elements Co, Ni, and Nd on the microstructures and mechanical properties of Sn-0.1Ag-0.7Cu (SAC0107) solder were investigated. The results show that the microstructures of SAC0107 alloy mainly consisted of primary Sn-rich phases and eutectic phases composed of Ag3Sn and Cu6Sn5 phases dispersed in a Sn matrix. With Co or Ni additions, the amount of primary Sn-rich phase reduced and IMCs dispersed more uniformly in the Sn matrix. The elements of Co and Ni were concentrated in (Co x Cu1−x )6Sn5 and (Ni x Cu1−x )6Sn5 intermetallic compounds (IMCs), respectively, and they also entered the IMC layer between solder alloys and Cu substrate during soldering. Shear strength of the joints all increased by adding Co, Ni, and Nd elements. Different from the Co and Nd additions, the addition of the Ni element also markedly improved the tensile strength and elongation of SAC0107 alloys.

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References

  1. J.J. Sundelina, S.T. Nurmib, T.K. Lepistö, and E.O. Ristolainen, Mater. Sci. Eng. A 420, 55 (2006).

    Article  Google Scholar 

  2. K. Kanlayasiria and T. Ariga, J. Alloys Compd. 504, L5 (2010).

    Article  Google Scholar 

  3. W.R. Osório, L.C. Peixoto, L.R. Garcia, N. Mangelinck-Noël, and A. Garcia, J. Alloys Compd. 572, 97 (2013).

    Article  Google Scholar 

  4. X.Y. Zhao, M.Q. Zhao, X.Q. Cui, T.H. Xu, and M.X. Tong, Chin. J. Nonferrous Met. 17, 805 (2007).

    Article  Google Scholar 

  5. K. Kanlayasiria, M. Mongkolwongrojnb, and T. Arigac, J. Alloys Compd. 485, 225 (2009).

    Article  Google Scholar 

  6. L.W. Lin, J.M. Song, Y.S. Lai, Y.T. Chiu, N.C. Lee, and J.Y. Uand, Microelectron. Reliab. 49, 235 (2009).

    Article  Google Scholar 

  7. F.J. Cheng, F. Gao, J.Y. Zhang, W.S. Jin, and X. Xiao, J. Mater. Sci. 46, 3424 (2011).

    Article  Google Scholar 

  8. I.E. Anderson, J.C. Foley, B.A. Cook, J. Harringa, R.L. Terpstra, and O. Unal, J. Electron. Mater. 30, 1050 (2001).

    Article  Google Scholar 

  9. Y. Liu, F.L. Sun, and Y. Liu, J. Mater. Sci. 24, 290 (2013).

    Google Scholar 

  10. L.L. Gao, S.B. Xue, L. Zhang, Z. Sheng, F. Ji, W. Dai, S.L. Yu, and G. Zeng, Microelectron. Eng. 87, 2025 (2010).

    Article  Google Scholar 

  11. Y.W. Wang, Y.W. Lin, C.T. Tu, and C.R. Kao, J. Alloys Compd. 478, 121 (2009).

    Article  Google Scholar 

  12. F. Gao, T. Takemoto, and H. Nishikawa, Mater. Sci. Eng. A 420, 39 (2006).

    Article  Google Scholar 

  13. I.E. Anderson, B.A. Cook, J. Harringa, and R.L. Terpstra, J. Electron. Mater. 31, 1166 (2002).

    Article  Google Scholar 

  14. W.J. Zhu, H.S. Liu, J.S. Wang, H.Q. Dong, and Z.P. Jin, J. Alloys Compd. 481, 503 (2009).

    Article  Google Scholar 

  15. Y.W. Wang, C.C. Chang, and C.R. Kao, J. Alloys Compd. 478, L1 (2009).

    Article  Google Scholar 

  16. J.M. Song, C.F. Huang, and H.Y. Chuang, J. Electron. Mater. 35, 2154 (2006).

    Article  Google Scholar 

  17. X. Zhao, M. Saka, M. Yamashita, and H. Hokazono, Microsyst. Technol. 18, 2077 (2012).

    Article  Google Scholar 

  18. ASTM, E 8M: Standard Test Methods for Tension Testing of Metallic Materials (West Conshohocken: ASTM International, 2004).

    Google Scholar 

  19. W.R. Osorio, D.R. Leiva, L.C. Peixoto, L.R. Garcia, and A. Garcia, J. Alloys Compd. 562, 194 (2013).

    Article  Google Scholar 

  20. L.R. Garcia, W.R. Osório, and A. Mater, Design 32, 3008 (2011).

    Article  Google Scholar 

  21. S. Fürtauer, D. Li, D. Cupid, and H. Flandorfer, Intermetallics 34, 142 (2013).

    Article  Google Scholar 

  22. S. Chen, S. Lee, and M. Yip, J. Electron. Mater. 32, 1284 (2003).

    Article  Google Scholar 

  23. K. Nogita, Intermetallics 18, 145 (2010).

    Article  Google Scholar 

  24. L.L. Gao, S.B. Xue, L. Zhang, Z. Sheng, G. Zeng, and F. Ji, J. Mater. Sci. 21, 643 (2010).

    Google Scholar 

  25. Y.H. Hu, S.B. Xue, H. Ye, Z.X. Xiao, L.L. Gao, and G. Zeng, Mater. Des. 34, 768 (2012).

    Article  Google Scholar 

  26. Z.G. Chen, Y.W. Shi, Z.D. Xia, and Y.F. Yan, J. Electron. Mater. 31, 1122 (2002).

    Article  Google Scholar 

  27. F.X. Che, W.H. Zhu, S.W. Poh, X.W. Zhang, and X.R. Zhang, J. Alloys Compd. 507, 215 (2010).

    Article  Google Scholar 

  28. S.W. Fu, C.Y. Yu, T.K. Lee, K.C. Liu, and J.G. Duh, Mater. Lett. 80, 103 (2012).

    Article  Google Scholar 

  29. C.E. Ho, Y.C. Lin, and S.J. Wang, Thin Solid Films 544, 551 (2013).

    Article  Google Scholar 

  30. G. Zeng, S.B. Xue, L.L. Gao, L. Zhang, Y.H. Hu, and Z.M. Lai, J. Alloys Compd. 509, 7152 (2011).

    Article  Google Scholar 

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Acknowledgements

The authors would like to acknowledge the financial support from the National Natural Science Foundation of China (51004039) and the Scientific Research Foundation of Graduate School of Southeast University (YBJJ1414).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Southeast University, Jiulonghu Campus, Jiangning District, Nanjing, 211189, China

    Xu Chen, Jian Zhou, Feng Xue, Jing Bai & Yao Yao

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  1. Xu Chen
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  2. Jian Zhou
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  3. Feng Xue
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Correspondence to Jian Zhou.

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Chen, X., Zhou, J., Xue, F. et al. Microstructures and Mechanical Properties of Sn-0.1Ag-0.7Cu-(Co, Ni, and Nd) Lead-Free Solders. J. Electron. Mater. 44, 725–732 (2015). https://doi.org/10.1007/s11664-014-3537-z

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  • DOI: https://doi.org/10.1007/s11664-014-3537-z

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