Skip to main content
SpringerLink
Log in

Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

The effect of a flux containing Cu(II) stearate (barrier flux) on the strength of soldered joints between an electroless Ni-Au surface finish and two Pb-free soldering systems, Sn-3Ag-0.5Cu and Sn-3.5Ag (wt.%), was examined. Pull and shock tests showed that barrier flux gave a higher joint strength for both solder compositions than did a flux containing no Cu compounds. Interface analysis revealed that a thin P-rich layer and refined Cu-Ni-Sn intermetallic compounds were formed at the joint interface when barrier flux was used. It is assumed that the supply of Cu from barrier flux suppresses diffusion of Ni into the solder.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Z. Mei, P. Gallery, D. Fisher, F. Hua, J. Glazer, Advances in Electronic Packaging—1997 (New York, NY: ASME 1997) 1543–1550

    Google Scholar 

  2. S. Sakatani, Y. Kohara, T. Saeki, K. Uenishi, K.F. Kobayashi, 12th Symposium on Microelectronics, (Osaka: Japan Institute of Electronics Packaging, 2002) 127–130

    Google Scholar 

  3. T. Hiramori, M. Ito, M. Yoshikawa, A. Hirose, K.F. Kobayashi, 12th Symposium on Microelectronics, (Osaka: Japan Institute of Electronics Packaging, 2002) 131–134

    Google Scholar 

  4. Y. Chonan, T. Komiyama, J. Onuki, R. Uraao, T. Kimura, T. Nagano, Mater. Trans. 43, 1840 (2002)

    Article  CAS  Google Scholar 

  5. N. Torazawa, S. Arai, Y. Takase, K. Sasaki, H. Saka, J. Jpn. Inst. Met. 66, 1122 (2002)

    CAS  Google Scholar 

  6. C.W. Hwang, K. Suganuma, M. Kiso, S. Hashimoto, J. Mater. Res. 18, 2540 (2003)

    Article  CAS  Google Scholar 

  7. C.W. Hwang, K. Suganuma, M. Kiso, S. Hashimoto, J. Electron. Mater. 33, 1200 (2004)

    Article  CAS  Google Scholar 

  8. Z. Chen, A. Kumar, M. Mona, J. Electron. Mater. 35, 2126 (2006)

    Article  CAS  Google Scholar 

  9. T. Hiramori, M. Ito, M. Yoshikawa, A. Hirose, K.F. Kobayashi, J. Jpn. Inst. Electron. Packaging. 6, 503 (2003)

    CAS  Google Scholar 

  10. Y. Chonan, T. Komiyama, J. Onuki, Surf. Mt. Technol. 54, 30 (2003)

    Google Scholar 

  11. Y. Nakahara, K. Hira, R. Ninomiya, M. Tagami, M. Sugai, Q. J. Jpn. Weld. Soc. 21, 116 (2003)

    Article  CAS  Google Scholar 

  12. T. Hiramori, M. Ito, Y. Tanii, A. Hirose, K.F. Kobayashi, 10th Symposium on Microjoining and Assembly Technology in Electronics (Yokohama: Japan Welding Society, 2004) 165–170

    Google Scholar 

  13. K. Yamamoto, H. Akahoshi, T. Kurashina, Y. Nozawa, R. Kimoto, 14th Symposium on Microelectronics, (Osaka: Japan Institute of Electronics Packaging, 2004) 77–80

    Google Scholar 

  14. Y.C. Shon, J. Yu, S.K. Kang, D.Y. Shih, and T.Y. Lee, Proceedings of the 55th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2005), pp. 83–88

  15. Y.D. Jeon, Y.B. Lee, and Y.S. Choi, Proceedings of the 56th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2006), pp. 119–124

  16. C.E. Ho, S.C. Yang, C.R. Kao, J. Mater. Sci.: Mater. Electron. 18, 155 (2007)

    Article  CAS  Google Scholar 

  17. S.W. Chen, C.H. Wang, J. Mater. Res. 21, 2270 (2006)

    Article  CAS  Google Scholar 

  18. S. Kumamoto, H. Sakurai, K. Ikeda, K. Suganuma, Mater. Trans. 46, 2380 (2005)

    Article  CAS  Google Scholar 

  19. Y.D. Jeon, K.W. Paik, K.S. Bok, W.S. Choi, and C.L. Cho, Proceedings of the 51th Electronic Components and Technology Conference (Lake Buena Vista, FL: IEEE, 2001), pp. 1326–1332

Download references

Author information

Authors and Affiliations

  1. Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, Ibaraki, 567-0047, Japan

    Seishi Kumamoto & Katsuaki Suganuma

  2. Electronics Materials Division, Research and Development Group, Harima Chemicals, Inc, Kakogawa, 675-0019, Japan

    Seishi Kumamoto, Hitoshi Sakurai & Youichi Kukimoto

Authors
  1. Seishi Kumamoto
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Hitoshi Sakurai
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Youichi Kukimoto
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Katsuaki Suganuma
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Seishi Kumamoto.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Kumamoto, S., Sakurai, H., Kukimoto, Y. et al. Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound. J. Electron. Mater. 37, 806–814 (2008). https://doi.org/10.1007/s11664-008-0408-5

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-008-0408-5

Keywords

Search

Navigation