Skip to main content
SpringerLink
Log in

Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

The effects of 1 wt.%, 5 wt.%, and 10 wt.% additions of indium (In) on the microstructure and compound morphology of Sn-Ag-Sb lead-free solder joints␣were examined. The results showed that In prompts the formation of Ag3(Sn,In), Ag2(In,Sn), and InSb compounds within the solder matrix. As the amount of In was increased, the Sn atoms in the Ag3Sn compound were gradually replaced by In atoms, prompting a transformation from Ag3Sn to Ag3(Sn,In) and finally to Ag2(In,Sn). This transformation occurs more readily under high-temperature conditions. The Ag2(In,Sn) compound formed in Sn-Ag-Sb-xIn/Cu solder joints was found to have either a leaf-like morphology or an antler-like morphology. Finally, with In additions greater than 5 wt.%, the Cu6Sn5 interfacial compounds in the solder/Cu joints transformed into Cu6(Sn,In)5.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. M. Abtew and G. Selvaduray, Mater. Sci. Eng. R 27, 95 (2000). doi:10.1016/S0927-796X(00)00010-3.

    Article  Google Scholar 

  2. D. Suraski and K. Seelig, IEEE. Trans. Electron. Pacakag. Manuf, 24, 4 (2001). http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=980031&isnumber=21107.

  3. T.-H. Chuang, H.-M. Wu, M.-D. Cheng, and S.-Y. Yen, J.␣Electron. Mater. 33, 1 (2004).

    Article  ADS  CAS  Google Scholar 

  4. M. McCormark, G.W. Kammlott, H.S. Chen, and S. Jin, Appl. Phys. Lett. 65, 1100 (1994).

    Article  ADS  Google Scholar 

  5. N. Wade, K. Wu, J. Kunil, S. Yamada, and K. Miyahara, J.␣Electron. Mater. 30, 9 (2001).

    Article  Google Scholar 

  6. Y. Kariya and M. Otsuka, J. Electron. Mater. 27, 11 (1998). doi:10.1007/s11664-998-0074-7.

    Google Scholar 

  7. F. Guo, S. Choi, J.P. Lucas, and K.N. Subramanian, Solder Surf. Mt. Technol. 13, 1 (2001). doi:10.1108/09540910110361668.

    Article  Google Scholar 

  8. H.-T. Lee and Y.-H. Lee, Mater. Sci. Eng. A 419, (2006). doi:10.1016/j.msea.2005.12.021.

  9. W.-K. Choi and H.-M. Lee, J. Mater. Res. 17, 1 (2002).

    Article  ADS  Google Scholar 

  10. R.K. Mahidhara, S.M.L. Sastry, I. Turlik, and K.L. Murty, Scr. Metall. Mater. 31, 1145 (1994).

    Article  CAS  Google Scholar 

  11. H.-T. Lee, S.-Y. Hu, T.-F. Hong, and Y.-F. Chen, J. Electron. Mater. 37, 867 (2008).

    Article  ADS  CAS  Google Scholar 

  12. H.-T. Lee, Yang, C.-L., Chen, M.H., and Li, C.S. Key Eng. Mater. 261–263 (2004). http://www.scientific.net/0-87849-938-5/501/, http://www.ttp.net/0-87849-938-5/8.html.

  13. H.-T. Lee, M.-H. Chen, H.-M. Jao, and C.-J. Hsu, J. Electron. Mater. 33, 9 (2004). doi:10.1007/s11664-004-0034-9.

    Google Scholar 

  14. V.I. Igoshev, J.I. Kleiman, D. Shangguan, S. Wong, and U.␣Michon, J. Electron. Mater. 29, 1356 (2000).

    Article  ADS  CAS  Google Scholar 

  15. Y.-S. Sun, F. Xue, and J. Zhou, IEEE 6th ICEPT (Shanghai, China, August 2005), pp. 253–257.

  16. M. McCormack and S. Jin, J. Electron. Mater. 23, 635 (1994).

    Article  ADS  CAS  Google Scholar 

  17. T.-H. Chuang, K.-W. Huang, and W.-H. Lin, J. Electron. Mater. 33, 4 (2004). doi:10.1007/s11664-004-0146-2.

    ADS  Google Scholar 

  18. Lead-Free Solder Project Final Report, NCMS Report 0404RE96 (National Center for Manufacturing Sciences, 1997).

  19. “Powder Diffraction File”, 2005. International Centre for Diffraction Data (www.icdd.com).

  20. ASM Handbook, “Alloy Phase Diagrams”, vol. 3 (Materials Park, OH: ASM International, 1992).

  21. ASM Metals Handbook, “Properties and Selection: Nonferrous Alloys and Special-Purpose Materials,” vol. 2, 12th ed. (Materials Park, OH: ASM International, 1990).

  22. A. Sharif and Y.-C. Chan, J. Alloys Compd. 390, 67 (2005). doi:10.1016/j.jallcom.2004.08.023.

  23. A. Sharif and Y.-C. Chan, Mater. Sci. Eng. B. B106 (2004). doi:10.1016/j.mseb.2003.09.004.

Download references

Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, National Cheng Kung University, No.1, University Road, Tainan City, 701, Taiwan, ROC

    Hwa-Teng Lee, Choo-Yeow Lee, Fok-Foo Lee & Yin-Fa Chen

  2. Department of Mechanical Engineering, Southern Taiwan University of Technology, Tainan, Taiwan

    Yang-Hsien Lee

Authors
  1. Hwa-Teng Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Choo-Yeow Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Fok-Foo Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yin-Fa Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Yang-Hsien Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Hwa-Teng Lee.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Lee, HT., Lee, CY., Lee, FF. et al. Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions. J. Electron. Mater. 38, 2112–2121 (2009). https://doi.org/10.1007/s11664-009-0884-2

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-009-0884-2

Keywords

Search

Navigation