Abstract
The friction behavior of the nanoscratching process is investigated using molecular dynamic simulations by considering a sphere indenter sliding against a nickel nanofilm structure. In the film/substrate system, the interface-dominated friction process is studied during the nanoscratch process. The results indicate that the interface accommodates deformation during the scratch by absorbing plastic deformation (such as stacking faults and partial dislocations) and by allowing locally interface slip. The observed local material shuffling beneath the tip that was strongly affected by the interface and friction mechanisms, including material ploughing along the track, filling in of the track, and piling up of the chip in front of the tip, are discussed. The combination effects of both scratching depths and film thicknesses were also investigated.
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Acknowledgments
This work was supported by the National Natural Science Foundation of China (Grants Nos. 10772096, 11021262, 10932011 and 91116003), and by the National Basic Research Program of China through 2012CB937500. The authors gratefully acknowledge useful discussions with Prof. F. P. Yuan from LNM at the Institute of Mechanics, Chinese Academy of Sciences.
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Liu, X.M., Liu, Z.L. & Wei, Y.G. Nanoscale Friction Behavior of the Ni-Film/Substrate System Under Scratching Using MD Simulation. Tribol Lett 46, 167–178 (2012). https://doi.org/10.1007/s11249-012-9932-9
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DOI: https://doi.org/10.1007/s11249-012-9932-9