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Precipitation and dissolution–grains growth effects and kinetics during non-isothermal heating of deformed Cu–7 mass% Ag alloy

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Abstract

The effect of plastic deformation on Cu–7 mass% Ag alloy transformation has been studied by differential dilatometry. The effects of recovery, precipitation and recrystallization reactions on the thermal expansion during heating have been explained through the microstructural characterization by X-ray diffraction and profile analysis, differential scanning calorimetry and transmission electron microscopy. The microstrain relaxation, domain growth, recrystallization, precipitation, dissolution and grains growth during heating are well established. An important grain growth effect at high temperature is revealed due to the releasing of the interfacial energy after primary recrystallization. Accordingly, the dilatometric evolution was elucidated. Kinetic analysis show that after deformation the interface diffusion controlling the precipitation process is not affected by deformation. It has constant activation energy with an average value of 120 ± 13 kJ mol−1. However, the activation energy of the volume diffusion controlling the grains growth process increases with the transformed fraction indicating the thermal stability.

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Acknowledgements

The authors would like to express their sincere thanks to Ellen Baken and Anna Carlsson from TEM Applications Laboratory of NanoPort FEI COMPANY (Netherlands).

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Authors and Affiliations

  1. Research Unit of Materials Sciences and Applications, Constantine 1 University, Ain El Bey Road, 25000, Constantine, Algeria

    D. Hamana

  2. Nuclear Research Centre of Birine, Bp 180, 17200, Ain Oussera, Djelfa, Algeria

    M. Hachouf

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  1. D. Hamana
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  2. M. Hachouf
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Correspondence to D. Hamana.

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Hamana, D., Hachouf, M. Precipitation and dissolution–grains growth effects and kinetics during non-isothermal heating of deformed Cu–7 mass% Ag alloy. J Therm Anal Calorim 123, 1063–1071 (2016). https://doi.org/10.1007/s10973-015-5066-2

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  • DOI: https://doi.org/10.1007/s10973-015-5066-2

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