Skip to main content

Advertisement

SpringerLink
Log in

Microstructure and mechanical properties of nano-Ag sintered joint enhanced by Cu foam

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Copper foam (Cu-F) was added into nano-Ag paste to obtain nano-Ag@Cu-F composite sintered joint. The microstructure, hardness, and shear behavior of the joints were investigated in comparison with the nano-Ag sintered joints. Experimental results indicated that the addition of Cu foam significantly decreased the void percentage at the sintered interface. The average hardness of the nano-Ag joints sharply increased from 0.64 to 1.46 GPa as the sintering time extended from 5 to 15 min. In contrast, the nano-Ag@Cu-F sintered layers were condensed within 5 min and the hardness reached 1.41 GPa. Further extension of the sintering time led to slow increase of the hardness. The shear strength of the sintered joints was enhanced due to the addition of Cu foam. Compared with the nano-Ag sintered joints, the composite joints showed greater shear distance to failure during the shear test. The shear fracture occurred in the sintered layer instead of the interface in the nano-Ag@Cu-F sintered joints since the bonding interface was enhanced by Cu foam addition. As the sintering time prolonged, the bonding quality of the sintered joints was improved and led to the increasing of shear strength.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11

Similar content being viewed by others

References

  1. M. Gleissner, M.M. Barkran, IEEE Trans Ind Appl 52(2), 1785 (2016)

    Google Scholar 

  2. H. Bian, Y. Song, D. Liu, Y. Lei, X. Song, J Cao (2019). https://doi.org/10.1016/j.cja.2019.03.040

    Google Scholar 

  3. J. Fan, K. Yung, M. Pecht, Expert Syst Appl 42(5), 2411 (2015)

    Article  Google Scholar 

  4. F. Yu, R.W. Johnson, M.C. Hamilton, IEEE. Trans Compon Pack Man 7(6), 855 (2017)

    Google Scholar 

  5. Y. Liu, H. Fu, H. Zhang, F. Sun, X. Wang, G. Zhang, J Mater Sci 28(24), 19113 (2017)

    Google Scholar 

  6. H. Zhang, Y. Liu, L. Wang, J. Fan, X. Fan, F. Sun, G. Zhang, Microelectron Reliab 81, 143 (2018)

    Article  Google Scholar 

  7. K.S. Siow, J Alloys Compd 514, 6 (2012)

    Article  Google Scholar 

  8. S.A. Paknejad, S.H. Mannan, Microelectron Reliab 70, 1 (2017)

    Article  Google Scholar 

  9. T. Morita, E. Ide, Y. Yasuda, A. Hirose, K. Kobayashi, Jpn J Appl Phys 47(8), 6615 (2008)

    Article  Google Scholar 

  10. M.S. Kim, H. Nishikawa, Microelectron Reliab 76, 420 (2017)

    Article  Google Scholar 

  11. Y. Mei, G. Chen, Y. Cao, X. Lin, D. Han, X. Chen, J Electron Mater 42(6), 1209 (2013)

    Article  Google Scholar 

  12. Y. Liu, H. Zhang, L. Wang, G. Zhang, F. Sun, Solder Surf Mt Technol 31(1), 20 (2018)

    Article  Google Scholar 

  13. W. Liu, Y. Wang, Z. Zheng, C. Wang, R. An, Y. Tian, L. Kong, R. Xu, J Mater Sci Mater Electron 30(8), 7787 (2019)

    Article  Google Scholar 

  14. H. Zhang, C. Chen, J. Jiu, S. Nagao, K. Suganuma, J Mater Sci Mater Electron 29(10), 8854 (2018)

    Article  Google Scholar 

  15. F. Yu, J. Cui, Z. Zhou, K. Fang, R.W. Johnson, M.C. Hamilton, IEEE Trans Power Electron 32(9), 7083 (2017)

    Article  Google Scholar 

  16. M. Wang, Y. Mei, X. Lin, R. Burgos, D. Boroyevich, G.Q. Lu, IEEE Trans Power Electron 34(8), 7121 (2019)

    Article  Google Scholar 

  17. Y. Liu, H. Zhang, L. Wang, X. Fan, G. Zhang, F. Sun, IEEE Trans Device Mater Reliab 18(2), 240 (2018)

    Article  Google Scholar 

  18. S. Wang, H. Ji, M. Li, C. Wang, Mater Lett 85, 61 (2012)

    Article  Google Scholar 

Download references

Acknowledgements

This work is supported by National Natural Science Foundation of China (No. 51604090) and Natural Science Foundation of Heilongjiang Province (No. E2017050).

Author information

Authors and Affiliations

  1. School of Materials Science and Engineering, Harbin University of Science and Technology, Harbin, 150040, People’s Republic of China

    Yang Liu, Zhao Li, Hao Zhang & Fenglian Sun

Authors
  1. Yang Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Zhao Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Hao Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Fenglian Sun
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Yang Liu.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Liu, Y., Li, Z., Zhang, H. et al. Microstructure and mechanical properties of nano-Ag sintered joint enhanced by Cu foam. J Mater Sci: Mater Electron 30, 15795–15801 (2019). https://doi.org/10.1007/s10854-019-01965-y

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-019-01965-y

Search

Navigation