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Reliability study of lead-free solders under specific conditions

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Abstract

Currently, accompanying the development of microelectronic joining and packaging, the integrated level of integrated circuit among the electronic devices has been substantially improved, which means the number of the soldered joints on a device is becoming more and more while the size of the micro-joint turns to be smaller and smaller. Given that soldered joints do play an important role in electronic packaging, serving as both mechanical bridges and electrical interconnections between the components and the bonding pads, to investigate the sensitivity of reliability of lead-free solders to various severe conditions deserves considerable concerns. This paper introduces the recent reliability research of lead-free solders under several specific conditions (e.g., isothermal aging, corrosive environment, drop impact, radiation) comprehensively, producing a fundamental summarization for the further reliability research.

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Acknowledgments

This work was supported by the Key Laboratory of Advanced Welding Technology of Jiangsu Province, China (JSAWT-14-04). This work was also supported by A Project Funded by the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD).

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  1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, 210016, People’s Republic of China

    Shuang Liu & Song-bai Xue

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  1. Shuang Liu
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Correspondence to Song-bai Xue.

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Liu, S., Xue, Sb. Reliability study of lead-free solders under specific conditions. J Mater Sci: Mater Electron 26, 9424–9442 (2015). https://doi.org/10.1007/s10854-015-3283-x

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  • DOI: https://doi.org/10.1007/s10854-015-3283-x

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