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Reliability of lead-free solder joints in CSP device under thermal cycling

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Abstract

Finite element method and Garofalo–Arrheninus creep model were combined and used to evaluate the reliability of different lead-free solder joints (SnAgCu, SnAg, SnSb and SnZn) and SnPb solder joints in chip scale package (CSP) 14 × 14 device under thermal cyclic loading. The results show that von Mises stress and equivalent creep strain in each of the four lead-free solder joints and SnPb solder joints were strongly different, increasing in the order SnPb < SnAg < SnSb < SnZn < SnAgCu. It is found that maximum stress–strain concentrates on the top-surface of corner solder joints in the CSP device for all solder joints, and SnAgCu solder joints shows the highest fatigue life among those five kinds of solder joints.

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Acknowledgments

The present work was carried out with the supported by the Natural Science Foundation of Jiangsu Province (BK2012144); the Natural Science Foundation of the Higher Education Institutions of Jiangsu Province (12KJB460005); the Jiangsu University of Science and Technology: Provincial Key Lab of Advanced Welding Technology Foundation (JSAWS-11-03) and the Jiangsu Normal University Foundation (11XLR16).

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Authors and Affiliations

  1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou, 221116, China

    Liang Zhang, Lei Sun, Yong-huan Guo & Cheng-wen He

  2. Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, CA, 90095, USA

    Liang Zhang

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  1. Liang Zhang
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  2. Lei Sun
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  3. Yong-huan Guo
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Correspondence to Liang Zhang.

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Zhang, L., Sun, L., Guo, Yh. et al. Reliability of lead-free solder joints in CSP device under thermal cycling. J Mater Sci: Mater Electron 25, 1209–1213 (2014). https://doi.org/10.1007/s10854-014-1711-y

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  • DOI: https://doi.org/10.1007/s10854-014-1711-y

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